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• W2922273270 endingPage "191" @default.
• W2922273270 startingPage "187" @default.
• W2922273270 abstract "Abstract Thermal mismatch problems can trigger the cracking of the InSb photosensitive layer, the local delamination and the performance degradation of the InSb infrared detector arrays (IDAs). We preferred the balanced composite structure (BCS) proposed by Jeffrey Barton to eliminate these typical failure phenomena. In the BCS, the silicon readout integrated circuit (Si-ROIC) was thinned to make its effective coefficient of thermal expansion (CTE) match the CTE of the InSb photosensitive layer. In order to assess the efficacy of the thinner Si-ROIC in the BCS, with the help of the established InSb IDAs assembly equivalent structure model, we quantitatively analyzed the effectivity of the thinned Si-ROIC in the elimination of the tensile stress (causing the InSb photosensitive layer to crack), the interfacial shear stress (leading to the local delamination of the InSb IDAs), and the peeling stress (giving rise to the edge delamination of the InSb IDAs). We observed that the tensile stress in the InSb photosensitive layer decreases linearly with the thinned Si-ROIC, besides, the interfacial shear stress and the peeling stress also decrease linearly with the thinned Si-ROIC in the range of 300–50 μm. When the Si-ROIC is thinner than 50 μm, the location, in which the local maximal shear stress or the maximal peeling stress appears, moves inward and deviates from its preceding location. All these simulation results clearly confirm that the thinner Si-ROIC in the BCS is an effective approach to concurrently reducing the three main failure stress components in the InSb IDAs assembly, and this major characteristic of concurrently decreasing the three main failure stress components contributes to completely solve the thermal mismatch problems in the InSb IDAs assembly." @default.
• W2922273270 created "2019-03-22" @default.
• W2922273270 creator A5009087092 @default.
• W2922273270 creator A5042956973 @default.
• W2922273270 creator A5071708665 @default.
• W2922273270 creator A5083493088 @default.
• W2922273270 date "2019-05-01" @default.
• W2922273270 modified "2023-10-14" @default.
• W2922273270 title "Analysis of thermal stresses in InSb IDAs assembly with thinner silicon ROIC" @default.
• W2922273270 cites W1993523155 @default.
• W2922273270 cites W2041514084 @default.
• W2922273270 cites W2059311480 @default.
• W2922273270 cites W2137184428 @default.
• W2922273270 cites W2191089857 @default.
• W2922273270 cites W2531105024 @default.
• W2922273270 cites W2758791125 @default.
• W2922273270 cites W2767202302 @default.
• W2922273270 cites W2769083649 @default.
• W2922273270 cites W2781769039 @default.
• W2922273270 doi "https://doi.org/10.1016/j.infrared.2019.03.011" @default.
• W2922273270 hasPublicationYear "2019" @default.
• W2922273270 type Work @default.
• W2922273270 sameAs 2922273270 @default.
• W2922273270 citedByCount "2" @default.
• W2922273270 countsByYear W29222732702020 @default.
• W2922273270 countsByYear W29222732702021 @default.
• W2922273270 crossrefType "journal-article" @default.
• W2922273270 hasAuthorship W2922273270A5009087092 @default.
• W2922273270 hasAuthorship W2922273270A5042956973 @default.
• W2922273270 hasAuthorship W2922273270A5071708665 @default.
• W2922273270 hasAuthorship W2922273270A5083493088 @default.
• W2922273270 hasConcept C121332964 @default.
• W2922273270 hasConcept C153294291 @default.
• W2922273270 hasConcept C192562407 @default.
• W2922273270 hasConcept C204530211 @default.
• W2922273270 hasConcept C49040817 @default.
• W2922273270 hasConcept C544956773 @default.
• W2922273270 hasConcept C61696701 @default.
• W2922273270 hasConceptScore W2922273270C121332964 @default.
• W2922273270 hasConceptScore W2922273270C153294291 @default.
• W2922273270 hasConceptScore W2922273270C192562407 @default.
• W2922273270 hasConceptScore W2922273270C204530211 @default.
• W2922273270 hasConceptScore W2922273270C49040817 @default.
• W2922273270 hasConceptScore W2922273270C544956773 @default.
• W2922273270 hasConceptScore W2922273270C61696701 @default.
• W2922273270 hasFunder F4320335581 @default.
• W2922273270 hasLocation W29222732701 @default.
• W2922273270 hasOpenAccess W2922273270 @default.
• W2922273270 hasPrimaryLocation W29222732701 @default.
• W2922273270 hasRelatedWork W2077666430 @default.
• W2922273270 hasRelatedWork W2121524308 @default.
• W2922273270 hasRelatedWork W2139871202 @default.
• W2922273270 hasRelatedWork W2292675962 @default.
• W2922273270 hasRelatedWork W2312552982 @default.
• W2922273270 hasRelatedWork W2399397734 @default.
• W2922273270 hasRelatedWork W2460230608 @default.
• W2922273270 hasRelatedWork W2769410768 @default.
• W2922273270 hasRelatedWork W2902546961 @default.
• W2922273270 hasRelatedWork W3127524829 @default.
• W2922273270 hasVolume "98" @default.
• W2922273270 isParatext "false" @default.
• W2922273270 isRetracted "false" @default.
• W2922273270 magId "2922273270" @default.
• W2922273270 workType "article" @default.