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- W2922351669 abstract "For the development of electronic packaging products, the mixture of micron-filler and nano-filler was adopted to improve the electronic property of conductive adhesive. The porpose of the addition of micron-filler and nano-filler is to achieve a higher conductive property, so that the perfect conductive adhesive could be obtained by the optimized conductive fillers. The conductive filler composed of Cu powders coated by nano-Ag layer and silver nanowire and resin matrix were mixed to fabricate conductive adhesive. The conductive filler composed of Cu powder coated by nano-Ag layer and silver nanowire could reduce the bulk resistivity and percolation threshold of conductive adhesive. When the conductive adhesive was cured at 170° for 60min using Cu powder coated by nano-Ag layer and silver nanowire as conductive filler and the content of filler was 60wt.%, the bulk resistivity of the newly formed conductive adhesive was low to $6.53times 10- 5 Omega cdot$ cm, while the shear strength of the adhesive was 5.36MPa." @default.
- W2922351669 created "2019-03-22" @default.
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- W2922351669 date "2018-12-01" @default.
- W2922351669 modified "2023-10-14" @default.
- W2922351669 title "A Study on the Preparation and Properties of Conductive Adhesive Filled with Multi-component Fillers for Green Packaging" @default.
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- W2922351669 doi "https://doi.org/10.1109/emap.2018.8660805" @default.
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