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• W2926246696 abstract "Decreasing the interconnecting temperature is essential for 3D and heterogeneous device integrations, which play indispensable roles in the coming era of “more than Moore”. Although nanomaterials exhibit a decreased onset temperature for interconnecting, such an effect is always deeply impaired because of organic additives in practical integrations. Meanwhile, current organic-free integration strategies suffer from roughness and contaminants at the bonding interface. Herein, a novel bilayer nanoarchitecture simultaneously overcomes the drawbacks of organics and is highly tolerant to interfacial morphology, which exhibits universal applicability for device-level integrations at even room temperature, with the overall performance outperforming most counterparts reported. This nanoarchitecture features a loose nanoparticle layer with unprecedented deformability for interfacial gap-filling, and a compact one providing firm bonding with the component surface. The two distinct nanoparticle layers cooperatively enhance the interconnecting performance by 73–357%. Apart from the absence of organics, the internal abundant lattice disorders profoundly accelerate the interconnecting process, which is supported by experiments and molecular dynamics simulation. This nanoarchitecture is successfully demonstrated in diversified applications including paper-based light-emitting diodes, Cu–Cu micro-bonding, and SiC power modules. The strategy proposed here can open a new paradigm for device integrations and provide a fresh understanding on interconnecting mechanisms." @default.
• W2926246696 created "2019-04-11" @default.
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• W2926246696 date "2019-04-04" @default.
• W2926246696 modified "2023-10-16" @default.
• W2926246696 title "Cooperative Bilayer of Lattice-Disordered Nanoparticles as Room-Temperature Sinterable Nanoarchitecture for Device Integrations" @default.
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• W2926246696 doi "https://doi.org/10.1021/acsami.9b00307" @default.
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• W2926246696 hasPublicationYear "2019" @default.
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