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- W2927961792 abstract "The recent advances and trends in fan-out wafer/panel-level packaging (FOW/PLP) are presented in this study. Emphasis is placed on: (A) the package formations such as (a) chip first and die face-up, (b) chip first and die face-down, and (c) chip last or redistribution layer (RDL)-first; (B) the RDL fabrications such as (a) organic RDLs, (b) inorganic RDLs, (c) hybrid RDLs, and (d) laser direct imaging (LDI)/printed circuit board (PCB) Cu platting and etching RDLs; (C) warpage; (D) thermal performance; (E) the temporary wafer versus panel carriers; and (F) the reliability of packages on PCBs subjected to thermal cycling condition. Some opportunities for FOW/PLP will be presented." @default.
- W2927961792 created "2019-04-11" @default.
- W2927961792 creator A5000222202 @default.
- W2927961792 date "2019-05-17" @default.
- W2927961792 modified "2023-10-10" @default.
- W2927961792 title "Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging" @default.
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