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• W2936685959 abstract "As the device nowadays scaled down to nanometer regime, focused ion beams (FIB) have successfully drawn considerable interest as a perfect tool for micromachining procedure. This technique offers with major application in failure analysis and circuit modification for various industrial semiconductor products. As a result, nanostructured defect can be allocated using this technique and can ensure the possible root cause of the product failure. The influence of beam emission applied on standard silicon wafer was investigated to understand the relationship between beam emissions and outcome of the milling depth. Therefore, milling process will be executed for isolation formation for circuit modification and failure analysis purpose performed at different ion beam current (0.43 to 9.3 nA/cm2)." @default.
• W2936685959 created "2019-04-25" @default.
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• W2936685959 date "2018-11-01" @default.
• W2936685959 modified "2023-10-14" @default.
• W2936685959 title "Study on Isolation Formation on Si Wafer Using Focused Ion Beam Technique" @default.
• W2936685959 doi "https://doi.org/10.1109/iccsce.2018.8685015" @default.
• W2936685959 hasPublicationYear "2018" @default.
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