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- W2939999353 abstract "Today, semiconductor devices with rapidly changing features are the basis for applications that deliver comfort, communication, mobility, environmental, and medical care. New requirements for reliability or environmental constraints are the driving factors to develop new materials, processes, and equipment. The development of new encapsulation methods including processes and materials allowed manufacturing of high performance, reliable, and cost-efficient microelectronic devices. This chapter provides a short history of molding, highlighting that the introduction of compression molding was a major change for semiconductor assembly and packaging. It describes why compression molding was the key for the implementation of the innovative extended wafer-level ball grid array (eWLB) technology in 2006. The chapter also describes the compression molding process for the new fan-out technology and the principle challenges. Finally, processing solutions that enable fully automatic compression molding with newly developed equipment are described. The new compression molding system was a significant breakthrough in semiconductor assembly and packaging technology." @default.
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- W2939999353 date "2019-01-18" @default.
- W2939999353 modified "2023-09-26" @default.
- W2939999353 title "Process and Equipment for eWLB" @default.
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- W2939999353 doi "https://doi.org/10.1002/9781119313991.ch17" @default.
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