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- W2940604282 abstract "While most industrial processes that include metal deposition use elevated temperatures, the majority of scientific investigations are done at room temperature. Thus, an electrochemical study of the effect of the temperature on the metal deposition was seen as necessary. For a basic study, the underpotential deposition (UPD) was chosen to be investigated as a controlled amount of metal can be deposited. The copper underpotential deposition (Cu-UPD) on Au(111) in sulphuric acid was chosen due to being a well-known model system. As the sulphate anion strongly influences the UPD process, perchloric acid was also studied to investigate the dependence on the strength of the adsorbing anion. To see whether or not the temperature dependence was only due to the metal deposition, the copper-free electrolytes were also investigated. For the metal-free electrolytes, only cyclic voltammetry was used. For the Cu-UPD the study used both cyclic voltammetry and chronoamperometry. The temperature range for the study was between 10°C and 55°C. It was found that the increase of the kinetic energy due to the increasing temperature affects the speed of the processes. Moreover, it affects the stability of the formed phases, especially for mobile adlayers. Additionally, alloying was seen for the Cu-UPD on Au(111) in perchloric acid." @default.
- W2940604282 created "2019-05-03" @default.
- W2940604282 creator A5081363873 @default.
- W2940604282 date "2018-09-07" @default.
- W2940604282 modified "2023-09-25" @default.
- W2940604282 title "Effects of temperature on gold single crystal electrochemistry" @default.
- W2940604282 doi "https://doi.org/10.17638/03031491" @default.
- W2940604282 hasPublicationYear "2018" @default.
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