Matches in SemOpenAlex for { <https://semopenalex.org/work/W2940852211> ?p ?o ?g. }
Showing items 1 to 97 of
97
with 100 items per page.
- W2940852211 endingPage "489" @default.
- W2940852211 startingPage "484" @default.
- W2940852211 abstract "Organic residues formed when using organic binders to increase the adhesive strength of Cu ink to PI substrates degrade the electrical conductivity of Cu electrodes. Binder-free Cu ink can be used to fabricate highly conductive Cu electrodes but lead to poor adhesion owing to inherently weak adhesion between the polymer substrates and metals. We therefore propose a facile method to enhance adhesion between a printed copper electrode formed by flash light sintering and a polyimide (PI) substrate without sacrificing the electrical conductivity by forming an interlocking structure at the interface between the Cu electrode made of binder-free ink and PI substrate through simple chemical treatment. The surface of the PI substrate was converted to polyamic acid (PAA) via potassium polyamate formation after sequential chemical treatment using potassium hydroxide and hydrochloric acid. During the flash light sintering process, the PAA layer, which is much softer than PI, could easily migrate into the cavities between the sintered Cu nanoparticles due to the pressure difference originating from evaporation of H2O released through reduction of the oxide shell of Cu nanoparticles. Thus, an interlocking structure was formed and the substrate surface quickly reverted to PI by absorbing thermal energy during sintering. The increased contact area between Cu nanoparticles and the substrate surface of the interlocking structure could explain the dramatic improvement of the adhesion strength of the Cu electrode from 0 B to 5 B, which corresponds to the highest class of adhesion strength. In addition, the resistivity of the Cu electrode fabricated in this process was measured to be 2.5 times larger (4.17 μΩ·cm) than that of bulk Cu, which has not been achieved for printed Cu electrodes before. Our results could lead to new perspectives in the field of printed electronics." @default.
- W2940852211 created "2019-05-03" @default.
- W2940852211 creator A5002930679 @default.
- W2940852211 creator A5009946596 @default.
- W2940852211 creator A5070320181 @default.
- W2940852211 creator A5081128424 @default.
- W2940852211 date "2019-08-01" @default.
- W2940852211 modified "2023-09-23" @default.
- W2940852211 title "Enhancing adhesion properties between binder-free copper nanoink and flexible substrate using chemically generated interlocking structure" @default.
- W2940852211 cites W1987433965 @default.
- W2940852211 cites W1993927906 @default.
- W2940852211 cites W2020787246 @default.
- W2940852211 cites W2051656649 @default.
- W2940852211 cites W2055825352 @default.
- W2940852211 cites W2064965912 @default.
- W2940852211 cites W2091109366 @default.
- W2940852211 cites W2096050373 @default.
- W2940852211 cites W2104513697 @default.
- W2940852211 cites W2124282138 @default.
- W2940852211 cites W2132200371 @default.
- W2940852211 cites W2132975148 @default.
- W2940852211 cites W2141657206 @default.
- W2940852211 cites W2157105221 @default.
- W2940852211 cites W2162494349 @default.
- W2940852211 cites W2163662493 @default.
- W2940852211 cites W2165542782 @default.
- W2940852211 cites W2278222465 @default.
- W2940852211 doi "https://doi.org/10.1016/j.apsusc.2019.04.234" @default.
- W2940852211 hasPublicationYear "2019" @default.
- W2940852211 type Work @default.
- W2940852211 sameAs 2940852211 @default.
- W2940852211 citedByCount "6" @default.
- W2940852211 countsByYear W29408522112020 @default.
- W2940852211 countsByYear W29408522112021 @default.
- W2940852211 countsByYear W29408522112022 @default.
- W2940852211 countsByYear W29408522112023 @default.
- W2940852211 crossrefType "journal-article" @default.
- W2940852211 hasAuthorship W2940852211A5002930679 @default.
- W2940852211 hasAuthorship W2940852211A5009946596 @default.
- W2940852211 hasAuthorship W2940852211A5070320181 @default.
- W2940852211 hasAuthorship W2940852211A5081128424 @default.
- W2940852211 hasConcept C111368507 @default.
- W2940852211 hasConcept C127313418 @default.
- W2940852211 hasConcept C127413603 @default.
- W2940852211 hasConcept C147789679 @default.
- W2940852211 hasConcept C155672457 @default.
- W2940852211 hasConcept C159985019 @default.
- W2940852211 hasConcept C171250308 @default.
- W2940852211 hasConcept C17525397 @default.
- W2940852211 hasConcept C185592680 @default.
- W2940852211 hasConcept C191897082 @default.
- W2940852211 hasConcept C192562407 @default.
- W2940852211 hasConcept C2777289219 @default.
- W2940852211 hasConcept C2777581544 @default.
- W2940852211 hasConcept C42360764 @default.
- W2940852211 hasConcept C544778455 @default.
- W2940852211 hasConcept C6556556 @default.
- W2940852211 hasConcept C84416704 @default.
- W2940852211 hasConceptScore W2940852211C111368507 @default.
- W2940852211 hasConceptScore W2940852211C127313418 @default.
- W2940852211 hasConceptScore W2940852211C127413603 @default.
- W2940852211 hasConceptScore W2940852211C147789679 @default.
- W2940852211 hasConceptScore W2940852211C155672457 @default.
- W2940852211 hasConceptScore W2940852211C159985019 @default.
- W2940852211 hasConceptScore W2940852211C171250308 @default.
- W2940852211 hasConceptScore W2940852211C17525397 @default.
- W2940852211 hasConceptScore W2940852211C185592680 @default.
- W2940852211 hasConceptScore W2940852211C191897082 @default.
- W2940852211 hasConceptScore W2940852211C192562407 @default.
- W2940852211 hasConceptScore W2940852211C2777289219 @default.
- W2940852211 hasConceptScore W2940852211C2777581544 @default.
- W2940852211 hasConceptScore W2940852211C42360764 @default.
- W2940852211 hasConceptScore W2940852211C544778455 @default.
- W2940852211 hasConceptScore W2940852211C6556556 @default.
- W2940852211 hasConceptScore W2940852211C84416704 @default.
- W2940852211 hasFunder F4320321681 @default.
- W2940852211 hasFunder F4320322120 @default.
- W2940852211 hasLocation W29408522111 @default.
- W2940852211 hasOpenAccess W2940852211 @default.
- W2940852211 hasPrimaryLocation W29408522111 @default.
- W2940852211 hasRelatedWork W1985087230 @default.
- W2940852211 hasRelatedWork W1989864322 @default.
- W2940852211 hasRelatedWork W2044686931 @default.
- W2940852211 hasRelatedWork W2085068030 @default.
- W2940852211 hasRelatedWork W2120507901 @default.
- W2940852211 hasRelatedWork W2167620349 @default.
- W2940852211 hasRelatedWork W2196867499 @default.
- W2940852211 hasRelatedWork W2347321207 @default.
- W2940852211 hasRelatedWork W2388750941 @default.
- W2940852211 hasRelatedWork W4309089005 @default.
- W2940852211 hasVolume "485" @default.
- W2940852211 isParatext "false" @default.
- W2940852211 isRetracted "false" @default.
- W2940852211 magId "2940852211" @default.
- W2940852211 workType "article" @default.