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- W2941844493 abstract "Direct electrodeposition of Ni-Cu alloy films from nickel matte precursor in choline chloride (ChCl)/urea (1:2 molar ratio) based deep eutectic solvent (DES) has been investigated. The nickel matte was firstly sintered with KCl at 450 °C for 45 min to form metal chlorides (NiCl2 and CuCl), then the chlorinated nickel matte was dissolved into ChCl/urea DES, which served as electrolyte for the electrodeposition of Ni-Cu alloy films. For comparison, electrodeposition of Ni-Cu alloy films from pure chlorides (NiCl2·6H2O and CuCl) precursors in ChCl/urea DES has also been investigated. Cyclic voltammetry analysis confirms that the two electrodeposition processes in DES are similar, and Ni-Cu alloy films with different compositions can be deposited in a controlled manner. The phase compositions, microstructures and corrosion resistance performances of the two Ni-Cu alloy films electrodeposited from different precursors have also been investigated and compared. It is suggested that the chlorination-electrodeposition process in DES is a promising strategy for the electrochemical extraction of alloys from complex raw materials." @default.
- W2941844493 created "2019-05-03" @default.
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- W2941844493 date "2019-06-01" @default.
- W2941844493 modified "2023-09-27" @default.
- W2941844493 title "Electrodeposition of Ni-Cu alloy films from nickel matte in deep eutectic solvent" @default.
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- W2941844493 doi "https://doi.org/10.1016/j.matchemphys.2019.04.052" @default.
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