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- W2942679451 abstract "In this work, an easy and low-temperature fabrication method of three-dimensional (3D) ceramic substrate was proposed. A 3DPC ceramic substrate was fabricated by molding alkali-activated aluminosilicate cement (AAAC) to form up a dam (cavity) on direct plated copper (DPC) ceramic substrate at low temperature. The effects of viscosity and curing temperature of cement paste on the properties of the 3DPC were investigated. The prepared 3DPC ceramic substrate achieved precise dimensions and structure, especially the manufacturing accuracy error was less than 2.5%. By optimizing process parameters, the shear strength between dam and DPC substrate reached up to 9.5 MPa. Moreover, thermal cycle and heat resistance tests confirmed that 3DPC exhibits excellent thermal reliability. All experimental results demonstrated that 3DPC ceramic substrate could satisfy with three dimension packaging and integration." @default.
- W2942679451 created "2019-05-09" @default.
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- W2942679451 date "2019-05-24" @default.
- W2942679451 modified "2023-09-24" @default.
- W2942679451 title "Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste" @default.
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- W2942679451 doi "https://doi.org/10.1115/1.4043645" @default.
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