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- W2945871959 abstract "Vapor cells as the key part of chip-scale atomic clocks determine their volume stability and power consumption. Micro-fabrication, especially the cavity packaging, is challenging. In this paper, micro-fabricated rubidium vapor cells are fabricated and the Au-In TLP bonding with asymmetric metal configuration is proposed and designed to package wafer-scale cell chips at a low processing temperature of 200 °C. Tests show that the designed intermetallic compounds AuIn2 and AuIn are uniformly formed in the asymmetric TLP bonding interlayer, indicating that the bonded interlayer can endure a post-processing temperature as high as 490 °C. The TLP bonded surface exhibits shear strength of 31.68 MPa, and the upper limit for the leak rate of the sealed vapor cell is 5 × 10−10 mbar · L s–1 which remains stable after undergoing a high temperature post-treatment. Meaning the proposed Au-In TLP bonding technique is applicable at low-temperature, hermetic and reliable wafer-scale packaging for micro-fabricated alkali vapor cells." @default.
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- W2945871959 date "2019-05-16" @default.
- W2945871959 modified "2023-10-17" @default.
- W2945871959 title "Micro-fabricated alkali vapor cells sealed at low temperature using asymmetric Au–In transient liquid phase (TLP) bonding" @default.
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- W2945871959 doi "https://doi.org/10.7567/1347-4065/ab0ac9" @default.
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