FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2946057532> ?p ?o ?g. }

• W2946057532 endingPage "6452" @default.
• W2946057532 startingPage "6436" @default.
• W2946057532 abstract "The aim of this study is to evaluate the electrochemical corrosion behavior of Sn-2 wt.% Ag and Sn-2.8 wt.% Cu solder alloys in a 0.5 M NaCl solution at 25oC as a function of microstructure features and Ag3Sn and Cu6Sn5 intermetallics. Both Sn-Ag and Sn-Cu alloys are becoming interesting lead-free solder alternatives. Microstructure morphologies obtained from a vertical water-cooled unidirectional solidification system under a cooling rate of about 15 oC/s are analyzed. Electrochemical impedance spectroscopy (EIS) diagrams, potentiodynamic polarization curves and an equivalent circuit analysis were used to evaluate the electrochemical parameters. It was found that although the relative cost 1.5 times higher for the Sn-2Ag alloy compared to that of the Sn-2.8Cu alloy, its corresponding electrochemical behavior is better in terms of polarization resistance, current density and pitting corrosion. This is shown to be intimately associated with the resulting fine and homogeneously distributed Ag3Sn intermetallic particles in the Sn-rich matrix." @default.
• W2946057532 created "2019-05-29" @default.
• W2946057532 creator A5018753274 @default.
• W2946057532 creator A5031282363 @default.
• W2946057532 creator A5067108494 @default.
• W2946057532 creator A5083650716 @default.
• W2946057532 creator A5091846347 @default.
• W2946057532 date "2012-01-01" @default.
• W2946057532 modified "2023-10-16" @default.
• W2946057532 title "The Effects of Microstructure and Ag3Sn and Cu6Sn5 Intermetallics on the Electrochemical Behavior of Sn-Ag and Sn-Cu Solder Alloys" @default.
• W2946057532 cites W1965434523 @default.
• W2946057532 cites W1965990077 @default.
• W2946057532 cites W1980139710 @default.
• W2946057532 cites W1980956884 @default.
• W2946057532 cites W1982864453 @default.
• W2946057532 cites W1987516217 @default.
• W2946057532 cites W1989737343 @default.
• W2946057532 cites W1999346536 @default.
• W2946057532 cites W2007514303 @default.
• W2946057532 cites W2017959119 @default.
• W2946057532 cites W2021999157 @default.
• W2946057532 cites W2024727388 @default.
• W2946057532 cites W2025287883 @default.
• W2946057532 cites W2034824677 @default.
• W2946057532 cites W2044692737 @default.
• W2946057532 cites W2054672989 @default.
• W2946057532 cites W2060060096 @default.
• W2946057532 cites W2064849953 @default.
• W2946057532 cites W2082242270 @default.
• W2946057532 cites W2084694234 @default.
• W2946057532 cites W2087616431 @default.
• W2946057532 cites W2094509780 @default.
• W2946057532 cites W2109219420 @default.
• W2946057532 cites W2123137167 @default.
• W2946057532 cites W2240201044 @default.
• W2946057532 cites W2271213136 @default.
• W2946057532 cites W2369963376 @default.
• W2946057532 cites W4382133326 @default.
• W2946057532 cites W4382141168 @default.
• W2946057532 cites W4382141503 @default.
• W2946057532 doi "https://doi.org/10.1016/s1452-3981(23)19493-4" @default.
• W2946057532 hasPublicationYear "2012" @default.
• W2946057532 type Work @default.
• W2946057532 sameAs 2946057532 @default.
• W2946057532 citedByCount "15" @default.
• W2946057532 countsByYear W29460575322013 @default.
• W2946057532 countsByYear W29460575322014 @default.
• W2946057532 countsByYear W29460575322015 @default.
• W2946057532 countsByYear W29460575322016 @default.
• W2946057532 countsByYear W29460575322018 @default.
• W2946057532 countsByYear W29460575322019 @default.
• W2946057532 countsByYear W29460575322020 @default.
• W2946057532 countsByYear W29460575322023 @default.
• W2946057532 crossrefType "journal-article" @default.
• W2946057532 hasAuthorship W2946057532A5018753274 @default.
• W2946057532 hasAuthorship W2946057532A5031282363 @default.
• W2946057532 hasAuthorship W2946057532A5067108494 @default.
• W2946057532 hasAuthorship W2946057532A5083650716 @default.
• W2946057532 hasAuthorship W2946057532A5091846347 @default.
• W2946057532 hasBestOaLocation W29460575321 @default.
• W2946057532 hasConcept C147789679 @default.
• W2946057532 hasConcept C17525397 @default.
• W2946057532 hasConcept C185592680 @default.
• W2946057532 hasConcept C191897082 @default.
• W2946057532 hasConcept C192562407 @default.
• W2946057532 hasConcept C205049153 @default.
• W2946057532 hasConcept C20625102 @default.
• W2946057532 hasConcept C27501479 @default.
• W2946057532 hasConcept C2780026712 @default.
• W2946057532 hasConcept C50296614 @default.
• W2946057532 hasConcept C52859227 @default.
• W2946057532 hasConcept C7040849 @default.
• W2946057532 hasConcept C87976508 @default.
• W2946057532 hasConceptScore W2946057532C147789679 @default.
• W2946057532 hasConceptScore W2946057532C17525397 @default.
• W2946057532 hasConceptScore W2946057532C185592680 @default.
• W2946057532 hasConceptScore W2946057532C191897082 @default.
• W2946057532 hasConceptScore W2946057532C192562407 @default.
• W2946057532 hasConceptScore W2946057532C205049153 @default.
• W2946057532 hasConceptScore W2946057532C20625102 @default.
• W2946057532 hasConceptScore W2946057532C27501479 @default.
• W2946057532 hasConceptScore W2946057532C2780026712 @default.
• W2946057532 hasConceptScore W2946057532C50296614 @default.
• W2946057532 hasConceptScore W2946057532C52859227 @default.
• W2946057532 hasConceptScore W2946057532C7040849 @default.
• W2946057532 hasConceptScore W2946057532C87976508 @default.
• W2946057532 hasIssue "7" @default.
• W2946057532 hasLocation W29460575321 @default.
• W2946057532 hasOpenAccess W2946057532 @default.
• W2946057532 hasPrimaryLocation W29460575321 @default.
• W2946057532 hasRelatedWork W1999552040 @default.
• W2946057532 hasRelatedWork W2010733322 @default.
• W2946057532 hasRelatedWork W2050291672 @default.
• W2946057532 hasRelatedWork W2377155807 @default.
• W2946057532 hasRelatedWork W2391379563 @default.
• W2946057532 hasRelatedWork W2542352128 @default.
• W2946057532 hasRelatedWork W2766515653 @default.
• W2946057532 hasRelatedWork W4221125667 @default.

• next