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- W2947606908 abstract "This paper introduces a numerical approach dealing with self-healing of solder materials, with detailed discussion of the damage and healing behavior of solder joints through creep deformation. The description of damage- and subsequent healing processes was done within the continuum damage mechanics (CDM) framework, assuming the formation of voids in the material due to creep deformation. The presented model considers a potential healing effect by void closure due to viscous flow of the solder-material and capillary forces. It is assumed that partial melting of a two-phase solder material facilitates this effect. The proposed healing model introduces a concept to describe void closing effects under consideration of phase transformation by using exemplary Sn-Bi alloys." @default.
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- W2947606908 date "2019-03-01" @default.
- W2947606908 modified "2023-09-23" @default.
- W2947606908 title "Numerical study on local effects of composition and geometry in self-healing solders" @default.
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- W2947606908 doi "https://doi.org/10.1109/eurosime.2019.8724583" @default.
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