FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2948607792> ?p ?o ?g. }

• W2948607792 endingPage "75341" @default.
• W2948607792 startingPage "75330" @default.
• W2948607792 abstract "A novel noncontact measurement method based on double-coil sensor is proposed for determining the thickness of copper (Cu) film on the silicon wafer in the process of stress free polishing (SFP). The double-coil sensor consists of two identical coaxial eddy current coils and corresponding auxiliary circuits, where the two coils are excited with the same sinusoidal signal and interact through the magnetic resonance coupling. The induced currents are produced in the Cu film through the electromagnetic coupling between double coils. The interaction equivalent circuit model of Cu film and two coils of double-coil sensor is discussed and the coil design and its lumped parameter extraction are analyzed. The linear relationship between the inductance difference of two coils and lift-off distance change (LODC) is formed and analyzed. By simulating the Cu film with different thicknesses sandwiched between two coils, the distribution and intensity of the magnetic field are presented. The slope of the relationship line between the inductance difference and the LODC is termed as SOR. Dependent on the LODC, the relationship between SOR and thickness of Cu film is extracted. Finally, the double-coil sensor is fabricated and the experiment is implemented. Different specimens with the thickness ranges from 100 to 500 nm are prepared and measured, where the measured maximum relative error is 4.7% and standard errors are between 2 and 13 nm. The experimental results demonstrate that the proposed measurement method is feasible and can confirm the thickness of Cu film on the silicon wafer. It is not only insensitive to the LODC but also can measure the thickness of less than 1 μm for Cu film on the silicon wafer." @default.
• W2948607792 created "2019-06-14" @default.
• W2948607792 creator A5003635803 @default.
• W2948607792 creator A5003936294 @default.
• W2948607792 creator A5016044907 @default.
• W2948607792 creator A5025361199 @default.
• W2948607792 creator A5052641956 @default.
• W2948607792 creator A5057484459 @default.
• W2948607792 date "2019-01-01" @default.
• W2948607792 modified "2023-10-18" @default.
• W2948607792 title "Noncontact Thickness Measurement of Cu Film on Silicon Wafer Using Magnetic Resonance Coupling for Stress Free Polishing Application" @default.
• W2948607792 cites W1632320884 @default.
• W2948607792 cites W1884651908 @default.
• W2948607792 cites W1964846842 @default.
• W2948607792 cites W1976805286 @default.
• W2948607792 cites W1987966270 @default.
• W2948607792 cites W1990052215 @default.
• W2948607792 cites W1995988158 @default.
• W2948607792 cites W2000246877 @default.
• W2948607792 cites W2013264892 @default.
• W2948607792 cites W2015503315 @default.
• W2948607792 cites W2021909294 @default.
• W2948607792 cites W2050174805 @default.
• W2948607792 cites W2060841971 @default.
• W2948607792 cites W2073433607 @default.
• W2948607792 cites W2085550696 @default.
• W2948607792 cites W2086722400 @default.
• W2948607792 cites W2099646238 @default.
• W2948607792 cites W2112884388 @default.
• W2948607792 cites W2116915908 @default.
• W2948607792 cites W2126887931 @default.
• W2948607792 cites W2139363620 @default.
• W2948607792 cites W2151454766 @default.
• W2948607792 cites W2189987460 @default.
• W2948607792 cites W2325108255 @default.
• W2948607792 cites W2341912461 @default.
• W2948607792 cites W2400725287 @default.
• W2948607792 cites W2527703646 @default.
• W2948607792 cites W2568724361 @default.
• W2948607792 cites W2983477691 @default.
• W2948607792 doi "https://doi.org/10.1109/access.2019.2921005" @default.
• W2948607792 hasPublicationYear "2019" @default.
• W2948607792 type Work @default.
• W2948607792 sameAs 2948607792 @default.
• W2948607792 citedByCount "4" @default.
• W2948607792 countsByYear W29486077922020 @default.
• W2948607792 countsByYear W29486077922023 @default.
• W2948607792 crossrefType "journal-article" @default.
• W2948607792 hasAuthorship W2948607792A5003635803 @default.
• W2948607792 hasAuthorship W2948607792A5003936294 @default.
• W2948607792 hasAuthorship W2948607792A5016044907 @default.
• W2948607792 hasAuthorship W2948607792A5025361199 @default.
• W2948607792 hasAuthorship W2948607792A5052641956 @default.
• W2948607792 hasAuthorship W2948607792A5057484459 @default.
• W2948607792 hasBestOaLocation W29486077921 @default.
• W2948607792 hasConcept C119599485 @default.
• W2948607792 hasConcept C121332964 @default.
• W2948607792 hasConcept C127413603 @default.
• W2948607792 hasConcept C131584629 @default.
• W2948607792 hasConcept C138113353 @default.
• W2948607792 hasConcept C159985019 @default.
• W2948607792 hasConcept C160671074 @default.
• W2948607792 hasConcept C165801399 @default.
• W2948607792 hasConcept C192562407 @default.
• W2948607792 hasConcept C2265751 @default.
• W2948607792 hasConcept C24890656 @default.
• W2948607792 hasConcept C29210110 @default.
• W2948607792 hasConcept C30403606 @default.
• W2948607792 hasConcept C46141821 @default.
• W2948607792 hasConcept C49040817 @default.
• W2948607792 hasConcept C51221625 @default.
• W2948607792 hasConcept C544956773 @default.
• W2948607792 hasConceptScore W2948607792C119599485 @default.
• W2948607792 hasConceptScore W2948607792C121332964 @default.
• W2948607792 hasConceptScore W2948607792C127413603 @default.
• W2948607792 hasConceptScore W2948607792C131584629 @default.
• W2948607792 hasConceptScore W2948607792C138113353 @default.
• W2948607792 hasConceptScore W2948607792C159985019 @default.
• W2948607792 hasConceptScore W2948607792C160671074 @default.
• W2948607792 hasConceptScore W2948607792C165801399 @default.
• W2948607792 hasConceptScore W2948607792C192562407 @default.
• W2948607792 hasConceptScore W2948607792C2265751 @default.
• W2948607792 hasConceptScore W2948607792C24890656 @default.
• W2948607792 hasConceptScore W2948607792C29210110 @default.
• W2948607792 hasConceptScore W2948607792C30403606 @default.
• W2948607792 hasConceptScore W2948607792C46141821 @default.
• W2948607792 hasConceptScore W2948607792C49040817 @default.
• W2948607792 hasConceptScore W2948607792C51221625 @default.
• W2948607792 hasConceptScore W2948607792C544956773 @default.
• W2948607792 hasFunder F4320320766 @default.
• W2948607792 hasFunder F4320333169 @default.
• W2948607792 hasLocation W29486077921 @default.
• W2948607792 hasLocation W29486077922 @default.
• W2948607792 hasOpenAccess W2948607792 @default.
• W2948607792 hasPrimaryLocation W29486077921 @default.
• W2948607792 hasRelatedWork W1984762390 @default.
• W2948607792 hasRelatedWork W2060962581 @default.
• W2948607792 hasRelatedWork W2141519347 @default.

• next