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• W2949062582 abstract "We introduce a fabrication method for gate-all-around nanowire field-effect transistors. Single nanowires were aligned perpendicular to underlying bottom gates using a resist-trench alignment technique. Top gates were then defined aligned to the bottom gates to form gate-all-around structures. This approach overcomes significant limitations in minimal obtainable gate length and gate-length control in previous horizontal wrap-gated nanowire transistors that arise because the gate is defined by wet-etching. In the method presented here gate-length control is limited by the resolution of the electron-beam-lithography process. We demonstrate the versatility of our approach by fabricating a device with an independent bottom gate, top gate, and gate-all-around structure as well as a device with three independent gate-all-around structures with 300, 200, and 150 nm gate length. Our method enables us to achieve subthreshold swings as low as 38 mV dec−1 at 77 K for a 150 nm gate length." @default.
• W2949062582 created "2019-06-27" @default.
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• W2949062582 date "2018-12-14" @default.
• W2949062582 modified "2023-10-15" @default.
• W2949062582 title "Achieving short high-quality gate-all-around structures for horizontal nanowire field-effect transistors" @default.
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• W2949062582 doi "https://doi.org/10.1088/1361-6528/aaf1e5" @default.
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