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- W2949769969 abstract "Atomic diffusion bonding of wafers using amorphous Ge (a–Ge) films was studied. Results indicate that the surface roughness S a of a–Ge films is expected to be less than 0.35 nm to obtain surface free energy at the bonded interface greater than 1 J/m2 at the interface of bonded a–Ge(20 nm) films." @default.
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- W2949769969 date "2019-05-01" @default.
- W2949769969 modified "2023-09-24" @default.
- W2949769969 title "Atomic Diffusion Bonding of Wafers using a-Ge Films with Extremely Low Electrical Conductivity" @default.
- W2949769969 doi "https://doi.org/10.23919/ltb-3d.2019.8735352" @default.
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