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- W2949969482 abstract "Adhesive wafer bonding using laminated photo-sensitive dry-resist offers many advantages and can be used to realize advanced, CMOS integrated, volume manufacturable lab-on-a-chip devices. The relatively low bond temperatures involved allow the wafer-level hybrid integration of a range of substrates, e.g., CMOS wafers with structured MEMS glass wafers. The dry-film polymer acts as the adhesive interlayer and can also be lithographically patterned to form sealed microfluidic fluid-channels and chambers after the bonding process." @default.
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- W2949969482 date "2019-05-01" @default.
- W2949969482 modified "2023-10-04" @default.
- W2949969482 title "Adhesive Wafer Bonding for CMOS based Lab-on-a-Chip Devices" @default.
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- W2949969482 doi "https://doi.org/10.23919/ltb-3d.2019.8735114" @default.
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