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- W2951263951 abstract "The dry etch properties of TiW layers, both below and above Al, are studied." @default.
- W2951263951 created "2019-06-27" @default.
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- W2951263951 date "1988-10-04" @default.
- W2951263951 modified "2023-09-27" @default.
- W2951263951 title "ChemInform Abstract: Dry Etching of Aluminum/TiW Layers for Multilevel Metallization in VLSI." @default.
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- W2951263951 doi "https://doi.org/10.1002/chin.198840303" @default.
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