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- W2951878274 endingPage "121586" @default.
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- W2951878274 abstract "In this study, 1-cyanoethyl-2-ethyl-4-methylimidazole (1C2E4MI) was modified by copper chloride to improve its thermal latency towards epoxy resins. Unexpected complexation between 1C2E4MI and copper chloride was discovered, and two complexes which included a liquid and a solid were generated. The microanalytical results show that the ligand-metal ratios of these two complexes are 7:1 (liquid) and 1:1 (solid), rather than the theoretical 4:1 ratio. The liquid 1C2E4MI-copper (II) complex (Complex-L) exhibits superior miscibility with epoxy resins, and the resulting epoxy systems show distinctly prolonged pot life at 25 and 60 °C. Curing kinetic study indicates the epoxy system containing Complex-L can be cured using a similar manner like that containing 1C2E4MI. Moreover, the epoxy resin cured with Complex-L has glass transition temperature and tensile properties comparable to that cured with 1C2E4MI." @default.
- W2951878274 created "2019-06-27" @default.
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- W2951878274 date "2019-09-01" @default.
- W2951878274 modified "2023-09-29" @default.
- W2951878274 title "A novel liquid imidazole-copper (II) complex as a thermal latent curing agent for epoxy resins" @default.
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- W2951878274 doi "https://doi.org/10.1016/j.polymer.2019.121586" @default.
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