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• W2951917745 abstract "Purpose The purpose of the paper is to experimentally evaluate the impact of voids on thermal conductivity of a macro solder joint formed between a copper cylinder and a copper plate by using reflow soldering. Design/methodology/approach A model of a surface mount device (SMD) was developed in the shape of a cylinder. A copper plate works as a printed circuit board (PCB). The resistor was connected to a power supply and the plate was cooled by a heat sink and a powerful fan. A macro solder joint was formed between a copper cylinder and a copper plate using reflow soldering and a lead-free solder paste SAC305. The solder paste was printed on a plate through stencils of various apertures. It was expected that various apertures of stencils will moderate the various void contents in solder joints. K-type thermocouples mounted inside cylinders and at the bottom of a plate underneath the cylinders measured the temperature gradient on both sides of the solder joint. After finishing the temperature measurements, the cylinders were thinned by milling to thickness of about 2 mm and then X-ray images were taken to evaluate the void contents. Finally the tablets were cross-sectioned to enable scanning electron microscopy (SEM) observations. Findings There was no clear dependence between thermal conductivity of solder joints and void contents. The authors state that other factors such as intermetallic layers, microcracks, crystal grain morfologyof the interface between the solder and the substrate influence on thermal conductivity. To support this observation, further investigations using metallographic methods are required. Originality/value Results allow us to assume that the use of SAC305 alloy for soldering of components with high thermal loads is risky. The common method for thermal balance calculation is based on the sum of serial thermal resistances of mechanical compounds. For these calculations, solder joints are represented with bulk SAC305 thermal conductivity parameters. Thermal conductivity of solder joints for high density of thermal energy is much lower than expected. Solder joints’ structure is not fully comparable with bulk SAC305 alloy. In experiments, the average value of the solder joint conductivity was found to be 8.1 W/m·K, which is about 14 per cent of the nominal value of SAC305 thermal conductivity." @default.
• W2951917745 created "2019-06-27" @default.
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• W2951917745 date "2019-06-03" @default.
• W2951917745 modified "2023-10-02" @default.
• W2951917745 title "Experimental approach to thermal conductivity of macro solder joints with voids" @default.
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• W2951917745 doi "https://doi.org/10.1108/ssmt-11-2018-0050" @default.
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