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- W2952830176 abstract "Metal thermo-compression bonding is an attractive approach for high electrically conductive wafer bonding. Its drawback of requiring high bonding temperature was solved by removing the native oxides. Low-temperature results on Cu-Cu and Al-Al bonding have been used to show on how different oxide removing pre-treatments enable high quality metal wafer bonding." @default.
- W2952830176 created "2019-06-27" @default.
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- W2952830176 date "2019-05-01" @default.
- W2952830176 modified "2023-09-24" @default.
- W2952830176 title "Oxide Removal for Low-Temperature Metal Thermo-Compression Wafer Bonding" @default.
- W2952830176 doi "https://doi.org/10.23919/ltb-3d.2019.8735225" @default.
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