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• W2953076151 abstract "Abstract Cryogenic systems that use cryocoolers with conduction cooling for attaining temperatures of 4.2 K and below routinely employ mechanically pressed components of copper to form the heat conduction path. To aid the design of such systems, the present paper reviews thermal contact resistance data of pressed copper-copper and gold-plated copper-copper contacts from nearly twenty measurement programs that span across past fifty years. Relevant theoretical models of thermal contact resistance are briefly reviewed and compared with the experimental data. Gold-plated copper contacts display reasonable trend with the models, which may serve as a design reference for such contacts. A few measurement techniques are also summarized that enable quick characterization of thermal contacts at low temperatures." @default.
• W2953076151 created "2019-06-27" @default.
• W2953076151 creator A5030451260 @default.
• W2953076151 date "2019-07-01" @default.
• W2953076151 modified "2023-10-15" @default.
• W2953076151 title "Pressed copper and gold-plated copper contacts at low temperatures – A review of thermal contact resistance" @default.
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• W2953076151 doi "https://doi.org/10.1016/j.cryogenics.2019.06.008" @default.
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