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- W2955732360 abstract "This paper is about a study of HF free extraction method for the analysis of Au contaminate on semiconductor wafer surface. The Au contaminate was extracted into a mixed acids extraction solution of HNO 3 and HCl by “Dynamic Thin Layer” (DTL) extraction method. Extraction solution was then analyzed with ICP-MS instrument. This study demonstrated an alternative method other than VPD-DC-ICP-MS and TXRF methods for the analysis of Au contaminate on the wafer surface." @default.
- W2955732360 created "2019-07-12" @default.
- W2955732360 creator A5035501712 @default.
- W2955732360 date "2019-03-01" @default.
- W2955732360 modified "2023-09-25" @default.
- W2955732360 title "A New Method for Extraction and Analysis of Au Contamination on Semiconductor Wafer Surface" @default.
- W2955732360 cites W1552852031 @default.
- W2955732360 doi "https://doi.org/10.1109/cstic.2019.8755754" @default.
- W2955732360 hasPublicationYear "2019" @default.
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