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• W2959390372 abstract "The metal/diamond interface consisting of two highly dissimilar materials is widely present in high-power microelectronic devices using a diamond film as a heat spreader or using a metal matrix/diamond filler composite as a heat sink for thermal management applications. To improve the interfacial thermal conductance (G), a common method is to add an appropriate interlayer in between the two materials; however, the effect of the interlayer on G is still not clear. In this work, we prepare a Cu/TiC/diamond structure by magnetron sputtering to detect how the crystallinity, grain size, and thickness of the TiC interlayer influence G between Cu and diamond. We characterize in detail the interface by transmission electron microscopy and X-ray photoelectron spectroscopy and measure experimentally G by the time-domain thermoreflectance technique. The results indicate that the higher crystallinity and thinner interlayer are both beneficial to the improvement of G between Cu and diamond, but the G is insensitive to the grain size of TiC. An increase of G between Cu and diamond as much as 48% can be reached by a highly crystallized 10 nm thick TiC interlayer. The microscopic characteristics of the TiC interlayer have played a decisive role for G between Cu and diamond. While an inserted interlayer in principle has a potential to enhance G between two dissimilar materials, the low crystallinity and large thickness of the interlayer will weaken the enhancement or even reverse this positive effect. The G of a sandwiched structure can be regulated in a wide range by the microscopic characteristics of the interlayer, which provides guidelines for preparation of metal/nonmetal interfaces with high interfacial thermal conductance for thermal management applications." @default.
• W2959390372 created "2019-07-23" @default.
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• W2959390372 date "2019-07-08" @default.
• W2959390372 modified "2023-10-14" @default.
• W2959390372 title "Regulated Interfacial Thermal Conductance between Cu and Diamond by a TiC Interlayer for Thermal Management Applications" @default.
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• W2959390372 doi "https://doi.org/10.1021/acsami.9b08106" @default.
• W2959390372 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/31283161" @default.
• W2959390372 hasPublicationYear "2019" @default.
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