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• W2967095578 abstract "Hybrid System-in-Foil (HySiF) complements the merits of the very-large scale integration of silicon ICs with the largerarea electronics [1] , [2] . Both worlds/concepts are integrated on mechanically flexible substrates using, in our case, ChipFilm Patch technology (CFP) [3] . In this work, two CFP-compatible components, namely a temperature sensor and an ultra-thin microcontroller IC, are electrically and thermally characterized. The thin-film temperature sensor is fabricated using platinum metal resistor. The extracted temperature coefficient ranges from 2 m to 3 m (Ω/Ω)/°C depending on the substrate composition. In addition, the CMOS microcontroller IC is back-thinned to 30 µm using the dicing-before-grinding process sequence (DBG) [4] . The on-chip temperature sensor, 10-bit analog-to-digital converter (ADC) and RC oscillators are then characterized and compared to a reference design. The extracted ADC performance in terms of linearity remained within the datasheet specifications. A slight drop in the on-chip temperature sensor sensitivity from 3.6 to 3.5 mV/°C is observed. Finally a shift in the absolute frequency of the lowfrequency oscillator is detected, and the period jitter of the high-frequency oscillator degraded significantly." @default.
• W2967095578 created "2019-08-22" @default.
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• W2967095578 date "2019-07-01" @default.
• W2967095578 modified "2023-09-24" @default.
• W2967095578 title "Characterization of Thin-Film Temperature Sensors and Ultra-Thin Chips for HySiF Integration" @default.
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• W2967095578 doi "https://doi.org/10.1109/fleps.2019.8792313" @default.
• W2967095578 hasPublicationYear "2019" @default.
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