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• W2970793955 abstract "We report the first successful technology integration of chiplets on an active silicon interposer, fully processed, packaged and tested. Benefits of chiplet-based architectures are discussed. Built up technology is presented and focused on 3D interconnects process and characterization. 3D packaging is presented up to the successful structural test and characterization of the demonstrator." @default.
• W2970793955 created "2019-09-05" @default.
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• W2970793955 date "2019-05-01" @default.
• W2970793955 modified "2023-10-10" @default.
• W2970793955 title "Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures" @default.
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• W2970793955 doi "https://doi.org/10.1109/ectc.2019.00092" @default.
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