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- W2972865460 abstract "Ablative processes for transparent materials processing still remains a hot topic, as current techniques still have their limitations in ablation rates and quality, particularly for features on the order of a millimeter or less. In this publication, we present results of recent work on laser micromachining of sapphire with ultrashort pulsed lasers in the sub-picosecond regime. We accomplish this by using bottom-up processing with laser ablation, which has demonstrated the ability to generate zero-taper features with relatively high aspect ratios (>1:1) in many transparent materials. In previous work with 1:1) in many transparent materials. In previous work with <1ps (1030nm) sources, we have demonstrated the ability to drill ≤250µm diameter holes in 430µm thick c-plane sapphire. Here, we extend the scope of this work to examine additional methods and laser parameters presented here. In particular we examine the benefits of frequency conversion to 515nm wavelength, allowing smaller spots and higher fluence levels is compared to trials at the fundamental wavelengt..." @default.
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- W2972865460 date "2016-01-01" @default.
- W2972865460 modified "2023-09-23" @default.
- W2972865460 title "Enhanced drilling of transparent materials with ultrashort pulses" @default.
- W2972865460 doi "https://doi.org/10.2351/1.5118611" @default.
- W2972865460 hasPublicationYear "2016" @default.
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