Matches in SemOpenAlex for { <https://semopenalex.org/work/W2974143448> ?p ?o ?g. }
- W2974143448 endingPage "100451" @default.
- W2974143448 startingPage "100451" @default.
- W2974143448 abstract "Conductive inks have gathered increasing attention in the fabrication of next-generation electronic devices because of their prominent compatibility and producibility. Recently, copper (Cu) inks as the new darling of conductive inks are studied extensively because Cu possesses an intrinsic high conductivity (comparable to the highest conductive metal, silver (Ag)) but an ultralow cost (about 1% the cost of Ag) with abundant reserves. However, the low resistance of Cu towards oxidation results in three issues, in aspects of the synthesis of stable Cu inks, the fabrication of highly conductive Cu patterns, and the long-term reliability of Cu-based electronic performances, which hinders the application prospect of Cu inks in the next-generation electronic devices. Herein, this review summaries the advanced developments of Cu inks in term of formulations, sintering methods, and long-term reliability. The mainstream strategies for avoiding oxidation and improving the stability of Cu inks and Cu patterns are described, while the efficient sintering methods and related sintering mechanisms are analyzed. The effect of ink formulations and sintering methods on the conductivity of Cu patterns on various substrates are also discussed. In addition, the strategies for the improvement of long-term reliability of Cu patterns and their application in various devices are summarized and forecasted. Finally, the challenges and future prospects for Cu inks are involved as well." @default.
- W2974143448 created "2019-09-26" @default.
- W2974143448 creator A5001747035 @default.
- W2974143448 creator A5052141120 @default.
- W2974143448 creator A5053775722 @default.
- W2974143448 creator A5060673071 @default.
- W2974143448 creator A5070481334 @default.
- W2974143448 creator A5077516851 @default.
- W2974143448 creator A5078819617 @default.
- W2974143448 creator A5081031339 @default.
- W2974143448 date "2020-03-01" @default.
- W2974143448 modified "2023-10-14" @default.
- W2974143448 title "The rise of conductive copper inks: challenges and perspectives" @default.
- W2974143448 cites W1787483934 @default.
- W2974143448 cites W1797158490 @default.
- W2974143448 cites W1860062710 @default.
- W2974143448 cites W1930827009 @default.
- W2974143448 cites W1965923866 @default.
- W2974143448 cites W1966204385 @default.
- W2974143448 cites W1966422823 @default.
- W2974143448 cites W1979144095 @default.
- W2974143448 cites W1980799863 @default.
- W2974143448 cites W1980855660 @default.
- W2974143448 cites W1980975853 @default.
- W2974143448 cites W1982575651 @default.
- W2974143448 cites W1985201108 @default.
- W2974143448 cites W1993634795 @default.
- W2974143448 cites W1993854642 @default.
- W2974143448 cites W1993938403 @default.
- W2974143448 cites W1994486358 @default.
- W2974143448 cites W1994498665 @default.
- W2974143448 cites W1995090980 @default.
- W2974143448 cites W1996324311 @default.
- W2974143448 cites W1997152910 @default.
- W2974143448 cites W1999572916 @default.
- W2974143448 cites W2000833091 @default.
- W2974143448 cites W2005046798 @default.
- W2974143448 cites W2009441925 @default.
- W2974143448 cites W2010337752 @default.
- W2974143448 cites W2010413474 @default.
- W2974143448 cites W2011123594 @default.
- W2974143448 cites W2013307721 @default.
- W2974143448 cites W2017320085 @default.
- W2974143448 cites W2018461450 @default.
- W2974143448 cites W2018566830 @default.
- W2974143448 cites W2019098181 @default.
- W2974143448 cites W2020473320 @default.
- W2974143448 cites W2021347410 @default.
- W2974143448 cites W2024640725 @default.
- W2974143448 cites W2026271506 @default.
- W2974143448 cites W2029263729 @default.
- W2974143448 cites W2034762129 @default.
- W2974143448 cites W2035929993 @default.
- W2974143448 cites W2042054129 @default.
- W2974143448 cites W2045269997 @default.
- W2974143448 cites W2045585258 @default.
- W2974143448 cites W2045681516 @default.
- W2974143448 cites W2046181975 @default.
- W2974143448 cites W2049431206 @default.
- W2974143448 cites W2050482233 @default.
- W2974143448 cites W2051473691 @default.
- W2974143448 cites W2051656649 @default.
- W2974143448 cites W2054947395 @default.
- W2974143448 cites W2059011656 @default.
- W2974143448 cites W2059087777 @default.
- W2974143448 cites W2060079243 @default.
- W2974143448 cites W2063508621 @default.
- W2974143448 cites W2066301944 @default.
- W2974143448 cites W2067695023 @default.
- W2974143448 cites W2070864860 @default.
- W2974143448 cites W2072375672 @default.
- W2974143448 cites W2076888495 @default.
- W2974143448 cites W2085441864 @default.
- W2974143448 cites W2085534863 @default.
- W2974143448 cites W2090711326 @default.
- W2974143448 cites W2090820599 @default.
- W2974143448 cites W2091034242 @default.
- W2974143448 cites W2091109366 @default.
- W2974143448 cites W2093767454 @default.
- W2974143448 cites W2094576153 @default.
- W2974143448 cites W2096341894 @default.
- W2974143448 cites W2105743323 @default.
- W2974143448 cites W2106051761 @default.
- W2974143448 cites W2108234203 @default.
- W2974143448 cites W2113418581 @default.
- W2974143448 cites W2114577380 @default.
- W2974143448 cites W2120115243 @default.
- W2974143448 cites W2120422576 @default.
- W2974143448 cites W2124094313 @default.
- W2974143448 cites W2129350131 @default.
- W2974143448 cites W2129707092 @default.
- W2974143448 cites W2130485976 @default.
- W2974143448 cites W2132200371 @default.
- W2974143448 cites W2137449062 @default.
- W2974143448 cites W2142512841 @default.
- W2974143448 cites W2145413915 @default.
- W2974143448 cites W2149627671 @default.
- W2974143448 cites W2150371565 @default.