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- W2974865239 abstract "In this work, an inline IR thermography system as an innovative application for real-time contactless temperature measurement of wafers - both metallized and non-metallized - during the firing process has been successfully realized in an industrial firing furnace as proof-of-concept and example for a thermography system in a conveyor furnace. As observed by the new system, thermocouples seem to measure lower temperature on wafers - especially in combination with thermocouple-frames – than wafers exhibit at standard firing conditions (here up to ΔT ≈ 40 K). Further, highly resolved spatial temperature distribution could be successfully measured on the wafer." @default.
- W2974865239 created "2019-09-26" @default.
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- W2974865239 date "2019-01-01" @default.
- W2974865239 modified "2023-10-17" @default.
- W2974865239 title "In-situ wafer temperature measurement during firing process via inline infrared thermography" @default.
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- W2974865239 doi "https://doi.org/10.1063/1.5125878" @default.
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