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• W2975808519 abstract "In this paper, we propose a novel, miniaturized non-dispersive infrared (NDIR) CO2 sensor implemented on a silicon chip. The sensor has a simple structure, consisting of a hollow metallic cylindrical cavity along with access waveguides. A detailed analysis of the proposed sensor is presented. Simulation with 3D ray tracing shows that an integrating cylinder with 4 mm diameter gives an equivalent optical path length of 3 . 5 cm. The sensor is fabricated using Deep Reactive Ion Etching (DRIE) and wafer bonding. The fabricated sensor was evaluated by performing a CO2 concentration measurement, showing a limit of detection of ∼100 ppm. The response time of the sensor is only ∼2.8 s, due to its small footprint. The use of DRIE-based waveguide structures enables mass fabrication, as well as the potential co-integration of flip-chip integrated midIR light-emitting diodes (LEDs) and photodetectors, resulting in a compact, low-power, and low-cost NDIR CO2 sensor." @default.
• W2975808519 created "2019-10-03" @default.
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• W2975808519 date "2019-09-30" @default.
• W2975808519 modified "2023-10-01" @default.
• W2975808519 title "On-Chip Non-Dispersive Infrared CO2 Sensor Based On an Integrating Cylinder" @default.
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• W2975808519 doi "https://doi.org/10.3390/s19194260" @default.
• W2975808519 hasPubMedCentralId "https://www.ncbi.nlm.nih.gov/pmc/articles/6806095" @default.
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