Matches in SemOpenAlex for { <https://semopenalex.org/work/W2977140986> ?p ?o ?g. }
- W2977140986 endingPage "159" @default.
- W2977140986 startingPage "150" @default.
- W2977140986 abstract "Purpose This paper aims to review recent advances and applications of abrasive processes for microelectronics fabrications. Design/methodology/approach More than 80 patents and journal and conference articles published recently are reviewed. The topics covered are chemical mechanical polishing (CMP) for semiconductor devices, key/additional process conditions for CMP, and polishing and grinding for microelectronics fabrications and fan-out wafer level packages (FOWLPs). Findings Many reviewed articles reported advanced CMP for semiconductor device fabrications and innovative research studies on CMP slurry and abrasives. The surface finish, sub-surface damage and the strength of wafers are important issues. The defects on wafer surfaces induced by grinding/polishing would affect the stability of diced ultra-thin chips. Fracture strengths of wafers are dependent on the damage structure induced during dicing or grinding. Different thinning processes can reduce or enhance the fracture strength of wafers. In the FOWLP technology, grinding or CMP is conducted at several key steps. Challenges come from back-grinding and the wafer warpage. As the Si chips of the over-molded FOWLPs are very thin, wafer grinding becomes critical. The strength of the FOWLPs is significantly affected by grinding. Originality/value This paper attempts to provide an introduction to recent developments and the trends in abrasive processes for microelectronics manufacturing. With the references provided, readers may explore more deeply by reading the original articles. Original suggestions for future research work are also provided." @default.
- W2977140986 created "2019-10-03" @default.
- W2977140986 creator A5056599169 @default.
- W2977140986 date "2019-10-07" @default.
- W2977140986 modified "2023-09-26" @default.
- W2977140986 title "Recent advances and applications of abrasive processes for microelectronics fabrications" @default.
- W2977140986 cites W1978183039 @default.
- W2977140986 cites W1982395240 @default.
- W2977140986 cites W1990596417 @default.
- W2977140986 cites W2042789821 @default.
- W2977140986 cites W2043736320 @default.
- W2977140986 cites W2056107922 @default.
- W2977140986 cites W2084942916 @default.
- W2977140986 cites W2130938951 @default.
- W2977140986 cites W2146394607 @default.
- W2977140986 cites W2180819467 @default.
- W2977140986 cites W2230475181 @default.
- W2977140986 cites W2318398974 @default.
- W2977140986 cites W2346241984 @default.
- W2977140986 cites W2346799817 @default.
- W2977140986 cites W2396662973 @default.
- W2977140986 cites W2441112898 @default.
- W2977140986 cites W2554462451 @default.
- W2977140986 cites W2580563717 @default.
- W2977140986 cites W2581898066 @default.
- W2977140986 cites W2593239619 @default.
- W2977140986 cites W2598664032 @default.
- W2977140986 cites W2601766912 @default.
- W2977140986 cites W2604408895 @default.
- W2977140986 cites W2608458191 @default.
- W2977140986 cites W2625946806 @default.
- W2977140986 cites W2736808350 @default.
- W2977140986 cites W2743905848 @default.
- W2977140986 cites W2744297396 @default.
- W2977140986 cites W2744766191 @default.
- W2977140986 cites W2744982745 @default.
- W2977140986 cites W2746474832 @default.
- W2977140986 cites W2750592280 @default.
- W2977140986 cites W2753607170 @default.
- W2977140986 cites W2762493025 @default.
- W2977140986 cites W2768803270 @default.
- W2977140986 cites W2780950673 @default.
- W2977140986 cites W2785491093 @default.
- W2977140986 cites W2795861834 @default.
- W2977140986 cites W2801996138 @default.
- W2977140986 cites W2802067608 @default.
- W2977140986 cites W2806833855 @default.
- W2977140986 cites W2887745393 @default.
- W2977140986 cites W2889494472 @default.
- W2977140986 cites W2897812406 @default.
- W2977140986 cites W2898409275 @default.
- W2977140986 cites W2898474622 @default.
- W2977140986 cites W2901114633 @default.
- W2977140986 cites W2920063072 @default.
- W2977140986 cites W2920412595 @default.
- W2977140986 doi "https://doi.org/10.1108/mi-05-2019-0024" @default.
- W2977140986 hasPublicationYear "2019" @default.
- W2977140986 type Work @default.
- W2977140986 sameAs 2977140986 @default.
- W2977140986 citedByCount "5" @default.
- W2977140986 countsByYear W29771409862021 @default.
- W2977140986 countsByYear W29771409862022 @default.
- W2977140986 crossrefType "journal-article" @default.
- W2977140986 hasAuthorship W2977140986A5056599169 @default.
- W2977140986 hasConcept C127413603 @default.
- W2977140986 hasConcept C138113353 @default.
- W2977140986 hasConcept C160671074 @default.
- W2977140986 hasConcept C165013422 @default.
- W2977140986 hasConcept C171250308 @default.
- W2977140986 hasConcept C180088628 @default.
- W2977140986 hasConcept C187937830 @default.
- W2977140986 hasConcept C191897082 @default.
- W2977140986 hasConcept C192562407 @default.
- W2977140986 hasConcept C2777571299 @default.
- W2977140986 hasConcept C2780957350 @default.
- W2977140986 hasConcept C78519656 @default.
- W2977140986 hasConceptScore W2977140986C127413603 @default.
- W2977140986 hasConceptScore W2977140986C138113353 @default.
- W2977140986 hasConceptScore W2977140986C160671074 @default.
- W2977140986 hasConceptScore W2977140986C165013422 @default.
- W2977140986 hasConceptScore W2977140986C171250308 @default.
- W2977140986 hasConceptScore W2977140986C180088628 @default.
- W2977140986 hasConceptScore W2977140986C187937830 @default.
- W2977140986 hasConceptScore W2977140986C191897082 @default.
- W2977140986 hasConceptScore W2977140986C192562407 @default.
- W2977140986 hasConceptScore W2977140986C2777571299 @default.
- W2977140986 hasConceptScore W2977140986C2780957350 @default.
- W2977140986 hasConceptScore W2977140986C78519656 @default.
- W2977140986 hasIssue "4" @default.
- W2977140986 hasLocation W29771409861 @default.
- W2977140986 hasOpenAccess W2977140986 @default.
- W2977140986 hasPrimaryLocation W29771409861 @default.
- W2977140986 hasRelatedWork W174677067 @default.
- W2977140986 hasRelatedWork W1965175656 @default.
- W2977140986 hasRelatedWork W2032476967 @default.
- W2977140986 hasRelatedWork W2052279114 @default.
- W2977140986 hasRelatedWork W217692474 @default.
- W2977140986 hasRelatedWork W2312770398 @default.