Matches in SemOpenAlex for { <https://semopenalex.org/work/W2977873091> ?p ?o ?g. }
- W2977873091 endingPage "5156" @default.
- W2977873091 startingPage "5144" @default.
- W2977873091 abstract "In order to apply power electronics systems to applications such as superconducting systems under cryogenic temperatures, it is necessary to investigate the characteristics of different parts in the power electronics system. This article reviews the influence of cryogenic temperature on power semiconductor devices including Si and wide bandgap switches, integrated circuits, passive components, interconnection and dielectric materials, and some typical cryogenic converter systems. Also, the basic theories and principles are given to explain the trends for different aspects of cryogenically cooled converters. Based on the review, Si active power devices, bulk Complementary metal-oxide-semiconductor (CMOS) based integrated circuits, nanocrystalline and amorphous magnetic cores, NP0 ceramic and film capacitors, thin/metal film and wirewound resistors are the components suitable for cryogenic operation. Pb-rich PbSn solder or In solder, classic printed circuit boards material, most insulation papers and epoxy encapsulant are good interconnection and dielectric parts for cryogenic temperatures." @default.
- W2977873091 created "2019-10-10" @default.
- W2977873091 creator A5014930285 @default.
- W2977873091 creator A5023216575 @default.
- W2977873091 creator A5030697868 @default.
- W2977873091 creator A5030815041 @default.
- W2977873091 creator A5038139314 @default.
- W2977873091 creator A5043261552 @default.
- W2977873091 creator A5043686014 @default.
- W2977873091 creator A5082396885 @default.
- W2977873091 creator A5083148278 @default.
- W2977873091 date "2020-05-01" @default.
- W2977873091 modified "2023-10-16" @default.
- W2977873091 title "Review of Power Electronics Components at Cryogenic Temperatures" @default.
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