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• W2980406410 abstract "We realized the implementation of an ultrathin piezoresistive Si chip and stretchable wires on a flexible film substrate by using simple screen-offset printing technology. This process does not require a special MEMS fabrication equipment (photolithography, etching, chip mounter etc.) and is applicable to Face-up chip where electrodes are formed on the top surface of the chip, as well as to Face-down chips where electrodes are formed on the bottom surface of the chip. This fabrication process is quite useful in the field of Flexible Hybrid Electronics (FHE) as a method for mounting and wiring electronic components. As its application, $5mu mathrm{m}$ -thick piezoresistive Si chips were transferred and wired on a polyimide film tape using screen-offset printing, a band-plaster type blood pulse sensor was fabricated. We successfully demonstrated that the blood pulse can be measured with neck and wrist." @default.
• W2980406410 created "2019-10-25" @default.
• W2980406410 creator A5019365855 @default.
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• W2980406410 date "2019-01-01" @default.
• W2980406410 modified "2023-09-25" @default.
• W2980406410 title "Novel Method for Simultaneously Implememting “Wired Face-Up and Face-Down Chips” on a Film Substrate by using Simple Screen-Offset Printing" @default.
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• W2980406410 doi "https://doi.org/10.1109/memsys.2019.8870629" @default.
• W2980406410 hasPublicationYear "2019" @default.
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