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- W2980457838 abstract "Three different patterns (rectangular-serpentine, U-serpentine and V-serpentine) of microchannels were modelled to investigate the fluid flow and heat transfer characteristics using the commercially available finite element analysis software—CFD Fluent. The microchannel models were based on 0.525-mm-thick silicon wafer substrate. The hydraulic diameter (0.4 mm) and channel length (114 mm) were kept constant in all the three different patterned microchannels to compare the performance of the microchannels. Three-dimensional (3D) simulations were performed to simulate near practical condition using the conjugate method in which heat transfer was considered in both solid and fluid zones. Reynolds number was varied in the range of 100–400, and uniform heat flux (30 kW/m2) was applied at the bottom wall of the microchannels to investigate the effect of microchannel pattern on pressure drop, temperature, velocity profile and heat transfer coefficients. Results confirm that the higher heat transfer coefficient was obtained in U-serpentine microchannel, indicating better performance among the three." @default.
- W2980457838 created "2019-10-25" @default.
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- W2980457838 date "2019-01-01" @default.
- W2980457838 modified "2023-09-23" @default.
- W2980457838 title "Effect of Microchannel Pattern on Fluid Flow and Heat Transfer Characteristics" @default.
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- W2980457838 doi "https://doi.org/10.1007/978-981-32-9072-3_73" @default.
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