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- W2981566103 abstract "This study deals with high quality thermal stress cleavage of thick sapphire wafer with thickness of 5 mm. The influence of the distance from the edge to the initial crack, laser power, and plane orientation on the cleavage characteristics was experimentally investigated. The results indicate that the surface waviness W a at the cleaved surface was influenced by the distance from the edge. A cleaved surface with good surface characteristics was obtained by cleaving with low laser power. The cleavage direction also affects the cleaved surface characteristics." @default.
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- W2981566103 date "2019-10-01" @default.
- W2981566103 modified "2023-09-24" @default.
- W2981566103 title "Study on High Quality Thermal Stress Cleavage of Thick Sapphire Wafer" @default.
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- W2981566103 doi "https://doi.org/10.4028/www.scientific.net/kem.825.39" @default.
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