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- W2984492927 abstract "The leading edge of semiconductor manufacturing is the high yield production of semiconductor devices with high lead counts and fine pitch. The packaging of these chips has become as challenging as the silicon manufacturing itself. The object of this paper is to describe the problems as well as the solutions required to wire bond these high lead count chips to their packages at the required high yields. The elements for achieving 6-σ wire bond yields can be summarized as follows: 1) the choice of metallization on the chip as well as on the package is critical; 2) an appropriate cleaning procedure (which in some circumstances may be at the wafer level) and/or special storage and shipping containers are necessary; 3) factorial bonder setup, and proper bond test methods are required; 4) uniform, reproducible wire and bonding machine characteristics are essential; and 5) both the chip bond pads and the package pads must be designed with full awareness of the limitations and tolerance of the chosen bonder and its bonding method" @default.
- W2984492927 created "2019-11-22" @default.
- W2984492927 creator A5083928328 @default.
- W2984492927 date "2003-01-02" @default.
- W2984492927 modified "2023-09-23" @default.
- W2984492927 title "Wire bonding-toward 6 sigma yield and fine pitch" @default.
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- W2984492927 doi "https://doi.org/10.1109/ectc.1992.204314" @default.
- W2984492927 hasPublicationYear "2003" @default.
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