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- W2990171567 abstract "The demands for packaging for either wafer or panel respectively heterogeneous integration in general are rising. New materials and technologies are needed to address the challenges resulting from that demands like better dielectric properties or higher resolution just to name two examples. The excimer laser ablation is able to meet that needs and process the new materials, which are not always photosensitive anymore. The system used for this paper is a combination of a projection stepper platform combined with an excimer laser. The field of application for this system is quite wide. It can be used for laser de-bonding of supporting substrates or the seed layer removal after galvanic. The main application, however, is the ablation of all types of polymers to generate VIAs for example. In contrast to already known PCB lasers, it is also possible to ablate complex structures in parallel, as it is a mask-based technology. Due to that, it is possible to generate trenches and VIAs within one step. This enables a technology already known from the front end of line (FEOL) to be transferred to the back end of line (BEOL): the dual damascene process. Within this paper, all the mentioned applications and the experience with a broad variety of polymer materials such as Polyimide, PBO, BCB, ABF, Dry Films are going to be presented. It is going to be shown that the excimer laser system can overcome the limitations of common polymers in terms of resolution and that the laser dual damascene approach can meet the needs for the overall demand towards 2um lines and space for packaging. Additionally some reliability data is presented that prove that the laser ablation can replace the today common lithography processes without any drawbacks." @default.
- W2990171567 created "2019-12-05" @default.
- W2990171567 creator A5009958649 @default.
- W2990171567 creator A5022711131 @default.
- W2990171567 creator A5027393888 @default.
- W2990171567 creator A5029258038 @default.
- W2990171567 creator A5036657741 @default.
- W2990171567 creator A5049335445 @default.
- W2990171567 creator A5059640571 @default.
- W2990171567 creator A5060247549 @default.
- W2990171567 date "2019-10-01" @default.
- W2990171567 modified "2023-10-04" @default.
- W2990171567 title "An Overview About the Excimer Laser Ablation of Different Polymers and Their Application for Wafer and Panel Level Packaging" @default.
- W2990171567 cites W2009585950 @default.
- W2990171567 cites W2040059231 @default.
- W2990171567 cites W2887802864 @default.
- W2990171567 cites W2904690279 @default.
- W2990171567 doi "https://doi.org/10.23919/iwlpc.2019.8914117" @default.
- W2990171567 hasPublicationYear "2019" @default.
- W2990171567 type Work @default.
- W2990171567 sameAs 2990171567 @default.
- W2990171567 citedByCount "0" @default.
- W2990171567 crossrefType "proceedings-article" @default.
- W2990171567 hasAuthorship W2990171567A5009958649 @default.
- W2990171567 hasAuthorship W2990171567A5022711131 @default.
- W2990171567 hasAuthorship W2990171567A5027393888 @default.
- W2990171567 hasAuthorship W2990171567A5029258038 @default.
- W2990171567 hasAuthorship W2990171567A5036657741 @default.
- W2990171567 hasAuthorship W2990171567A5049335445 @default.
- W2990171567 hasAuthorship W2990171567A5059640571 @default.
- W2990171567 hasAuthorship W2990171567A5060247549 @default.
- W2990171567 hasConcept C116372231 @default.
- W2990171567 hasConcept C120665830 @default.
- W2990171567 hasConcept C121332964 @default.
- W2990171567 hasConcept C133386390 @default.
- W2990171567 hasConcept C160671074 @default.
- W2990171567 hasConcept C171250308 @default.
- W2990171567 hasConcept C180088628 @default.
- W2990171567 hasConcept C187504802 @default.
- W2990171567 hasConcept C192562407 @default.
- W2990171567 hasConcept C2779188808 @default.
- W2990171567 hasConcept C2779227376 @default.
- W2990171567 hasConcept C2780477314 @default.
- W2990171567 hasConcept C49040817 @default.
- W2990171567 hasConcept C520434653 @default.
- W2990171567 hasConceptScore W2990171567C116372231 @default.
- W2990171567 hasConceptScore W2990171567C120665830 @default.
- W2990171567 hasConceptScore W2990171567C121332964 @default.
- W2990171567 hasConceptScore W2990171567C133386390 @default.
- W2990171567 hasConceptScore W2990171567C160671074 @default.
- W2990171567 hasConceptScore W2990171567C171250308 @default.
- W2990171567 hasConceptScore W2990171567C180088628 @default.
- W2990171567 hasConceptScore W2990171567C187504802 @default.
- W2990171567 hasConceptScore W2990171567C192562407 @default.
- W2990171567 hasConceptScore W2990171567C2779188808 @default.
- W2990171567 hasConceptScore W2990171567C2779227376 @default.
- W2990171567 hasConceptScore W2990171567C2780477314 @default.
- W2990171567 hasConceptScore W2990171567C49040817 @default.
- W2990171567 hasConceptScore W2990171567C520434653 @default.
- W2990171567 hasLocation W29901715671 @default.
- W2990171567 hasOpenAccess W2990171567 @default.
- W2990171567 hasPrimaryLocation W29901715671 @default.
- W2990171567 hasRelatedWork W1492558285 @default.
- W2990171567 hasRelatedWork W1974693229 @default.
- W2990171567 hasRelatedWork W1985518305 @default.
- W2990171567 hasRelatedWork W2014863873 @default.
- W2990171567 hasRelatedWork W2029586119 @default.
- W2990171567 hasRelatedWork W2033747859 @default.
- W2990171567 hasRelatedWork W2056611946 @default.
- W2990171567 hasRelatedWork W2062729969 @default.
- W2990171567 hasRelatedWork W2085022659 @default.
- W2990171567 hasRelatedWork W2091450036 @default.
- W2990171567 hasRelatedWork W2098686532 @default.
- W2990171567 hasRelatedWork W2104780626 @default.
- W2990171567 hasRelatedWork W2302071023 @default.
- W2990171567 hasRelatedWork W2314944227 @default.
- W2990171567 hasRelatedWork W2340131335 @default.
- W2990171567 hasRelatedWork W2344880068 @default.
- W2990171567 hasRelatedWork W2512695275 @default.
- W2990171567 hasRelatedWork W2624915764 @default.
- W2990171567 hasRelatedWork W3013009575 @default.
- W2990171567 hasRelatedWork W3013345483 @default.
- W2990171567 isParatext "false" @default.
- W2990171567 isRetracted "false" @default.
- W2990171567 magId "2990171567" @default.
- W2990171567 workType "article" @default.