Matches in SemOpenAlex for { <https://semopenalex.org/work/W2995812694> ?p ?o ?g. }
Showing items 1 to 91 of
91
with 100 items per page.
- W2995812694 endingPage "499" @default.
- W2995812694 startingPage "487" @default.
- W2995812694 abstract "This chapter presents comparisons between planar architectures that use silicon back-end wiring technologies that essentially represent the upper end of the I/O/mm/layer spectrum and offer silicon-level connectivity on package. Embedded multi-die interconnect bridge (EMIB) is a planar dense multi-chip packages technology, where the basic concept is that it uses thin pieces of silicon with multilayer back-end-of-line interconnects, embedded in organic substrates, to enable dense die-to-die interconnects. The chapter describes the EMIB technology architecture and the high level EMIB process flow followed by a discussion of the high bandwidth envelope. It focuses on the electrical signaling performance of EMIB. Typically EMIB is used to connect two adjacent dies. This results in a relatively short I/O channel that does not demand complex transceiver circuits to meet signal integrity requirements. The chapter also presents results from eye diagram simulations to demonstrate that the I/O channel and circuits can meet signal integrity requirements." @default.
- W2995812694 created "2019-12-26" @default.
- W2995812694 creator A5016254763 @default.
- W2995812694 creator A5017551612 @default.
- W2995812694 creator A5034294902 @default.
- W2995812694 creator A5041557013 @default.
- W2995812694 creator A5072057094 @default.
- W2995812694 creator A5085059490 @default.
- W2995812694 creator A5088834533 @default.
- W2995812694 creator A5090515850 @default.
- W2995812694 date "2019-01-18" @default.
- W2995812694 modified "2023-09-27" @default.
- W2995812694 title "Embedded Multi‐die Interconnect Bridge (EMIB)" @default.
- W2995812694 cites W2006267100 @default.
- W2995812694 cites W2024479790 @default.
- W2995812694 cites W2099571807 @default.
- W2995812694 cites W2131583913 @default.
- W2995812694 cites W2169194072 @default.
- W2995812694 cites W2518432791 @default.
- W2995812694 cites W2571413934 @default.
- W2995812694 doi "https://doi.org/10.1002/9781119313991.ch23" @default.
- W2995812694 hasPublicationYear "2019" @default.
- W2995812694 type Work @default.
- W2995812694 sameAs 2995812694 @default.
- W2995812694 citedByCount "3" @default.
- W2995812694 countsByYear W29958126942020 @default.
- W2995812694 countsByYear W29958126942022 @default.
- W2995812694 crossrefType "other" @default.
- W2995812694 hasAuthorship W2995812694A5016254763 @default.
- W2995812694 hasAuthorship W2995812694A5017551612 @default.
- W2995812694 hasAuthorship W2995812694A5034294902 @default.
- W2995812694 hasAuthorship W2995812694A5041557013 @default.
- W2995812694 hasAuthorship W2995812694A5072057094 @default.
- W2995812694 hasAuthorship W2995812694A5085059490 @default.
- W2995812694 hasAuthorship W2995812694A5088834533 @default.
- W2995812694 hasAuthorship W2995812694A5090515850 @default.
- W2995812694 hasConcept C111106434 @default.
- W2995812694 hasConcept C119599485 @default.
- W2995812694 hasConcept C121684516 @default.
- W2995812694 hasConcept C123745756 @default.
- W2995812694 hasConcept C127162648 @default.
- W2995812694 hasConcept C127413603 @default.
- W2995812694 hasConcept C134146338 @default.
- W2995812694 hasConcept C134786449 @default.
- W2995812694 hasConcept C146667757 @default.
- W2995812694 hasConcept C165005293 @default.
- W2995812694 hasConcept C24326235 @default.
- W2995812694 hasConcept C2776257435 @default.
- W2995812694 hasConcept C41008148 @default.
- W2995812694 hasConcept C44938667 @default.
- W2995812694 hasConcept C46362747 @default.
- W2995812694 hasConcept C76155785 @default.
- W2995812694 hasConcept C7720470 @default.
- W2995812694 hasConcept C78519656 @default.
- W2995812694 hasConceptScore W2995812694C111106434 @default.
- W2995812694 hasConceptScore W2995812694C119599485 @default.
- W2995812694 hasConceptScore W2995812694C121684516 @default.
- W2995812694 hasConceptScore W2995812694C123745756 @default.
- W2995812694 hasConceptScore W2995812694C127162648 @default.
- W2995812694 hasConceptScore W2995812694C127413603 @default.
- W2995812694 hasConceptScore W2995812694C134146338 @default.
- W2995812694 hasConceptScore W2995812694C134786449 @default.
- W2995812694 hasConceptScore W2995812694C146667757 @default.
- W2995812694 hasConceptScore W2995812694C165005293 @default.
- W2995812694 hasConceptScore W2995812694C24326235 @default.
- W2995812694 hasConceptScore W2995812694C2776257435 @default.
- W2995812694 hasConceptScore W2995812694C41008148 @default.
- W2995812694 hasConceptScore W2995812694C44938667 @default.
- W2995812694 hasConceptScore W2995812694C46362747 @default.
- W2995812694 hasConceptScore W2995812694C76155785 @default.
- W2995812694 hasConceptScore W2995812694C7720470 @default.
- W2995812694 hasConceptScore W2995812694C78519656 @default.
- W2995812694 hasLocation W29958126941 @default.
- W2995812694 hasOpenAccess W2995812694 @default.
- W2995812694 hasPrimaryLocation W29958126941 @default.
- W2995812694 hasRelatedWork W1961878373 @default.
- W2995812694 hasRelatedWork W1976936912 @default.
- W2995812694 hasRelatedWork W1982029981 @default.
- W2995812694 hasRelatedWork W2018643788 @default.
- W2995812694 hasRelatedWork W2046518366 @default.
- W2995812694 hasRelatedWork W2057179452 @default.
- W2995812694 hasRelatedWork W2147405720 @default.
- W2995812694 hasRelatedWork W2164509473 @default.
- W2995812694 hasRelatedWork W2899084033 @default.
- W2995812694 hasRelatedWork W3197871674 @default.
- W2995812694 isParatext "false" @default.
- W2995812694 isRetracted "false" @default.
- W2995812694 magId "2995812694" @default.
- W2995812694 workType "other" @default.