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- W2997473754 abstract "Hybrid integration technology, including die-to-wafer bonding and flip-chip bonding, is introduced for realizing high-performance modulators and lasers on a silicon photonic integrated circuit." @default.
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- W2997473754 date "2019-11-02" @default.
- W2997473754 modified "2023-09-23" @default.
- W2997473754 title "Silicon Photonic Devices and Circuits Based on Hybrid Integration" @default.
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