FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2998159764> ?p ?o ?g. }

• W2998159764 endingPage "145254" @default.
• W2998159764 startingPage "145254" @default.
• W2998159764 abstract "Abstract The stability, reactivity and functionality of modern nanostructured and nanoarchitectured materials, like nano-multilayers (NMLs) and nanocomposites (NCs), are generally ruled by fast short-circuit diffusion of atoms along internal interfaces, such as phase and grain boundaries (GBs), at relatively low temperatures. Residual stresses can have a significant effect on the kinetics of short-circuit diffusion in these nanomaterials, which has been largely neglected up to date. We present a combined experimental-modelling approach for deriving stress-free activation energies (and related diffusion coefficients) for the grain boundary diffusion of a given element across an inert barrier nanolayer, which can be utilized to perform fundamental investigations and model predictions of GB diffusion kinetics across inert barrier nanolayers in the presence of a varying stress field. The method was applied to investigate the diffusion of Cu along W grain boundaries in Cu/W nano-multilayers in the temperature range from 400 °C to 600 °C. Firstly, the GB diffusion kinetics as function of the temperature and stress state were determined from experiment by combining in situ heating AES analysis and ex situ XRD stress analysis. The experimental data were compared to model predictions from a modified Hwang–Balluffi model, which accounts for a varying stress level within the barrier during the annealing. The extracted stress-free activation energy for grain boundary diffusion of Cu in W (~0.29 eV) is substantially lower than the respective experimental value for a high compressive stress within the W barrier nanolayer. The corresponding stress-free Cu GB diffusion coefficient in W equals D b ∗ = 3.2 ± 0.6 × 10 - 15 e x p - 0.29 ± 0.02 e V / k T c m 2 / s ." @default.
• W2998159764 created "2020-01-10" @default.
• W2998159764 creator A5010935066 @default.
• W2998159764 creator A5028856141 @default.
• W2998159764 creator A5047751928 @default.
• W2998159764 creator A5050359948 @default.
• W2998159764 creator A5063147926 @default.
• W2998159764 creator A5081460570 @default.
• W2998159764 date "2020-04-01" @default.
• W2998159764 modified "2023-09-24" @default.
• W2998159764 title "Effect of internal stress on short-circuit diffusion in thin films and nanolaminates: Application to Cu/W nano-multilayers" @default.
• W2998159764 cites W1965671703 @default.
• W2998159764 cites W1972222268 @default.
• W2998159764 cites W1974702779 @default.
• W2998159764 cites W1975123347 @default.
• W2998159764 cites W1977886233 @default.
• W2998159764 cites W1981710551 @default.
• W2998159764 cites W1983536218 @default.
• W2998159764 cites W1983717408 @default.
• W2998159764 cites W1988924107 @default.
• W2998159764 cites W1991469020 @default.
• W2998159764 cites W2002391329 @default.
• W2998159764 cites W2003120532 @default.
• W2998159764 cites W2005151500 @default.
• W2998159764 cites W2009003566 @default.
• W2998159764 cites W2018461325 @default.
• W2998159764 cites W2025510413 @default.
• W2998159764 cites W2033778010 @default.
• W2998159764 cites W2044788157 @default.
• W2998159764 cites W2045115674 @default.
• W2998159764 cites W2045129676 @default.
• W2998159764 cites W2046056082 @default.
• W2998159764 cites W2046321856 @default.
• W2998159764 cites W2048405740 @default.
• W2998159764 cites W2048473185 @default.
• W2998159764 cites W2052512604 @default.
• W2998159764 cites W2053186299 @default.
• W2998159764 cites W2061319720 @default.
• W2998159764 cites W2073675832 @default.
• W2998159764 cites W2074011170 @default.
• W2998159764 cites W2076677140 @default.
• W2998159764 cites W2078752030 @default.
• W2998159764 cites W2082463710 @default.
• W2998159764 cites W2084469529 @default.
• W2998159764 cites W2092923784 @default.
• W2998159764 cites W2103169975 @default.
• W2998159764 cites W2109721025 @default.
• W2998159764 cites W2118646269 @default.
• W2998159764 cites W2193144396 @default.
• W2998159764 cites W2200653194 @default.
• W2998159764 cites W2211579990 @default.
• W2998159764 cites W2266694938 @default.
• W2998159764 cites W2326152839 @default.
• W2998159764 cites W2462217107 @default.
• W2998159764 cites W2555198075 @default.
• W2998159764 cites W2563552767 @default.
• W2998159764 cites W2770055970 @default.
• W2998159764 cites W2770648596 @default.
• W2998159764 cites W2774191526 @default.
• W2998159764 cites W2890884649 @default.
• W2998159764 cites W2896155588 @default.
• W2998159764 cites W2903467955 @default.
• W2998159764 cites W2908535543 @default.
• W2998159764 cites W2942282655 @default.
• W2998159764 cites W2961238639 @default.
• W2998159764 cites W2973564003 @default.
• W2998159764 cites W4237399525 @default.
• W2998159764 doi "https://doi.org/10.1016/j.apsusc.2020.145254" @default.
• W2998159764 hasPublicationYear "2020" @default.
• W2998159764 type Work @default.
• W2998159764 sameAs 2998159764 @default.
• W2998159764 citedByCount "20" @default.
• W2998159764 countsByYear W29981597642020 @default.
• W2998159764 countsByYear W29981597642021 @default.
• W2998159764 countsByYear W29981597642022 @default.
• W2998159764 countsByYear W29981597642023 @default.
• W2998159764 crossrefType "journal-article" @default.
• W2998159764 hasAuthorship W2998159764A5010935066 @default.
• W2998159764 hasAuthorship W2998159764A5028856141 @default.
• W2998159764 hasAuthorship W2998159764A5047751928 @default.
• W2998159764 hasAuthorship W2998159764A5050359948 @default.
• W2998159764 hasAuthorship W2998159764A5063147926 @default.
• W2998159764 hasAuthorship W2998159764A5081460570 @default.
• W2998159764 hasConcept C121332964 @default.
• W2998159764 hasConcept C138885662 @default.
• W2998159764 hasConcept C159985019 @default.
• W2998159764 hasConcept C171250308 @default.
• W2998159764 hasConcept C19067145 @default.
• W2998159764 hasConcept C192562407 @default.
• W2998159764 hasConcept C21036866 @default.
• W2998159764 hasConcept C2780357685 @default.
• W2998159764 hasConcept C2988361403 @default.
• W2998159764 hasConcept C41895202 @default.
• W2998159764 hasConcept C69357855 @default.
• W2998159764 hasConcept C97355855 @default.
• W2998159764 hasConceptScore W2998159764C121332964 @default.
• W2998159764 hasConceptScore W2998159764C138885662 @default.
• W2998159764 hasConceptScore W2998159764C159985019 @default.

• next