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• W3000595251 startingPage "110136" @default.
• W3000595251 abstract "This paper investigates the interdependence of the stacking fault energy (SFE) and the stress required for dislocation multiplication. For this purpose copper-aluminum (Cu-Al) alloys with varying Al content are investigated by spherical nanoindentation. The load-displacement curve shows a characteristic pop-in, which is interpreted as elastic-plastic transition and correlated to the dislocation source nucleation and/or activation stress. The statistical analysis of the pop-in behaviour documents a strong dependence of the maximum shear stress beneath the indenter on the Al content, which cannot be explained by a variation in shear modulus. Instead, the pop-in stress clearly increases with increasing stacking fault energy." @default.
• W3000595251 created "2020-01-23" @default.
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• W3000595251 date "2020-03-01" @default.
• W3000595251 modified "2023-09-29" @default.
• W3000595251 title "Does the stacking fault energy affect dislocation multiplication?" @default.
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• W3000595251 doi "https://doi.org/10.1016/j.matchar.2020.110136" @default.
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