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- W3005210080 abstract "The thermo-mechanical performance of fingers in a crystalline silicon photovoltaic (PV) cell is often discussed in the domain of solder layer degradation due to their close proximity, and vulnerability under transient temperature variations. This paper discusses thermo-mechanical damage at common interfaces of the solder layer. It was established that the finger-solder interface is most prone to breakages. Further, effect of variable solder geometrical parameters on damage accumulation at the finger-solder interface was investigated. Solder thickness was found to be a crucial parameter. The variable width simulation demonstrated increased damage accumulation due to the case of over-soldering." @default.
- W3005210080 created "2020-02-14" @default.
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- W3005210080 date "2019-06-01" @default.
- W3005210080 modified "2023-09-24" @default.
- W3005210080 title "Thermo-mechanical degradation at finger-solder interface in a crystalline silicon photovoltaic module under thermal fatigue conditions" @default.
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- W3005210080 doi "https://doi.org/10.1109/pvsc40753.2019.8980538" @default.
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