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- W3009551457 abstract "We have studied the interdiffusion and compound formation at the a-Si/Au and a-Si/Cu thin film interfaces using x-ray reflectivity and grazing incidence EXAFS techniques. In the 0 °C as-deposited samples, reaction between Si and Au is minimal, but reaction between Si and Cu is significant. Upon annealing for ten minutes in argon, the a-Si crystallized and reacted quite extensively with Au at 160 °C. Further reaction between Si and Cu proceeded at 130 °C. The compounds formed appear to be metal-rich silicides in both the Si/Au and Si/Cu systems. For Au/Si the silicide is likely stabilized on the surface of the newly formed crystallites." @default.
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- W3009551457 date "1992-01-01" @default.
- W3009551457 modified "2023-09-23" @default.
- W3009551457 title "Interfacial reaction in a-Si/Au and a-Si/Cu thin film bilayers" @default.
- W3009551457 hasPublicationYear "1992" @default.
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