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- W3013374310 abstract "The need for and use of ion beam mixing of metal silicides for very large scale integrated (VLSI) circuit technology is discussed in the form of a literature review and tutorial paper. Where possible, the formation of titanium disilicide (TiSi2) is discussed, although other metal silicides are considered. Throughout the paper, the relevance of ion beam mixing to the formation of devices is emphasized. In addition, the integration of this technique into a VLSI process flow is presented. It is concluded that for the technique of ion beam mixing to be considered for VLSI processing, research should be concentrated on micrometer‐sized features. In addition, ion beam mixing of Ti and SiO2 requires further investigation since the self‐aligned complementary metal‐oxide‐semiconductor (CMOS) process demands negligible interaction between these two materials. With this in mind, it is suggested that ion beam mixing of W and Mo silicides presents an easier target." @default.
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- W3013374310 date "1986-12-01" @default.
- W3013374310 modified "2023-09-23" @default.
- W3013374310 title "Titanium silicide formation by ion beam mixing and rapid thermal annealing" @default.
- W3013374310 hasPublicationYear "1986" @default.
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