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- W3015470757 abstract "This paper presents the design, fabrication, and characterization of a self-packaged three axis capacitive MEMS accelerometer fabricated by using only four masks that is capable of differentially sensing the externally applied accelerations in three orthogonal axes. Individual lateral and vertical axis accelerometers are fabricated in the same die on a SOI wafer, which is eutectically bonded to a silicon substrate. Handle layer of the SOI wafer is both used as the top electrode for the vertical axis accelerometer, and a capping layer for all accelerometers. Vertical axis accelerometer has a 2 mm <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> perforated electrode area anchored to the Si substrate by four beams. The lateral axis accelerometers on the other hand, have comb finger structures with a <tex xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>$2.4 times 1.9 mathrm{mm}^{2}$</tex> device area and anchored to the Si substrate by four folded beams. Three axis accelerometer has a dimension of <tex xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>$8.45 times 4.0 times 0.84 mathrm{mm}^{3}$</tex> . Rest capacitance of the vertical axis accelerometer is designed to be 12 pF, and it is 10 pF for the lateral axis accelerometers." @default.
- W3015470757 created "2020-04-17" @default.
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- W3015470757 date "2020-01-01" @default.
- W3015470757 modified "2023-09-23" @default.
- W3015470757 title "Self-Packaged Three Axis Capacitive Mems Accelerometer" @default.
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- W3015470757 doi "https://doi.org/10.1109/mems46641.2020.9056192" @default.
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