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- W3021388826 abstract "This paper presents the co-implementation of resistive random access memory inside a 180nm CMOS chip for low-cost, energy-efficient neuromorphic hardware accelerators. Systematic evaluation of different TaO x -based ReRAM stacks was performed to derive the optimal ReRAM stack that shows high spatial and temporal uniformities without compromising CMOS back-end-of-line compatibility. Detailed comparison among six different ReRAM stacks can reduce power consumption by $sim89$% and increase uniformity by $sim66$% via proper material selection. The optimized ReRAM cells are directly integrated on standard CMOS foundry chips, enabling low-cost, high-yield integration with high energy efficiency, fast speeds, high uniformity, suitable for neuromorphic computing applications." @default.
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- W3021388826 date "2019-09-01" @default.
- W3021388826 modified "2023-10-18" @default.
- W3021388826 title "Co-Design of Highly Uniform ReRAM Arrays in 180nm CMOS Technology for Neuromorphic Systems" @default.
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- W3021388826 doi "https://doi.org/10.1109/socc46988.2019.1570553076" @default.
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