Matches in SemOpenAlex for { <https://semopenalex.org/work/W3021553204> ?p ?o ?g. }
- W3021553204 abstract "Publisher SummaryThis chapter focuses on silicon-based micromachining processes, as silicon has excellent mechanical properties, making it an ideal material for machining. Micromachining refers to the fabrication of micromechanical structures with the aid of etching techniques to remove part of the substrate or a thin film. The chapter discusses the wealth of micromachining processes that are available to the device developer. These include both wet and dry etching techniques, and bulk and surface micromachining. Bulk micromachining covers all techniques that remove significant amounts of the substrate material and the bulk is part of the micromachined structure, whereas surface micromachining involves depositing thin films on the wafer surface and selectively removing one or more of these layers to leave free-standing structures. Wet etching of silicon is used if large amounts of the silicon bulk have to be removed. The chapter illustrates and discusses two types of wet etching techniques: anisotropic etching and isotropic etching." @default.
- W3021553204 created "2020-05-13" @default.
- W3021553204 creator A5018029462 @default.
- W3021553204 creator A5064630364 @default.
- W3021553204 date "2006-01-01" @default.
- W3021553204 modified "2023-10-05" @default.
- W3021553204 title "Micromachining Technology" @default.
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