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- W302312693 abstract "This study investigates effects of aging in air and argon at 170 C on Cu coupons which were pretinned with 75Sn-25Pb, 8Sn-92Pb, and 5Sn-95Pb solders. Coatings were applied using electroplating or hot dipping techniques. The coating thickness was controlled between 3 to 3μm and the specimens were aged for 0 hours, 2 hours, 24 hours and 2 weeks. Wetting balance tests were used to evaluate the wettability of the test specimens. Microstructural development was evaluated using X-ray diffraction, energy dispersive X-ray and Auger spectroscopy, as well as optical and scanning electron microscopy. The wetting behavior of the test specimens is interpreted with respect to observed microstructural changes and as a function of aging time, solder composition, and processing conditions." @default.
- W302312693 created "2016-06-24" @default.
- W302312693 creator A5027829314 @default.
- W302312693 date "1993-11-01" @default.
- W302312693 modified "2023-09-26" @default.
- W302312693 title "Aging effects on the microstructure, surface characteristics and wettability of Cu pretinned with Sn-Pb solders" @default.
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- W302312693 doi "https://doi.org/10.2172/10125229" @default.
- W302312693 hasPublicationYear "1993" @default.
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