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- W3023647660 abstract "Silver (Ag) particle sintering joining technology is promising for next-generation power semiconductor. In this study, we report a robust joint by Ag sinter joining technology for different metal interface (Au, Ag, Ni) metallization and the high temperature reliability of Ag sinter joint structure. The die shear strength for the Au, Ag metallization substrate increased with the sintering temperature and achieved 29.8 MPa and 45.6 MPa for Au, Ag metallization joint at sintering temperature of 350°C, respectively. In addition, the die shear strength for the Ni metallization substrate achieved the maximum value of 43.5 MPa at the sintering temperature of 300°C but decreased to 30 MPa at 350°C because of the Ni oxide generation. The high temperature aging test at 250°C for 1000 h were performed for the three metallization layers, and the results show that Ag metallization joint structure have a best high temperature stability." @default.
- W3023647660 created "2020-05-13" @default.
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- W3023647660 date "2019-08-01" @default.
- W3023647660 modified "2023-09-26" @default.
- W3023647660 title "Sinter Ag joining on different metallization substrate and their high temperature reliability" @default.
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- W3023647660 doi "https://doi.org/10.1109/icept47577.2019.245324" @default.
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