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- W3023974655 abstract "Publisher SummaryThis chapter provides an overview of basic microfabrication techniques. It covers photolithography and thin-film technologies, adopted from the microelectronic industry, the development of thick resists and other novel material shaping processes. These techniques have led the way to new applications of microfabrication processes for, e.g., microfluidic devices. The chapter also explains silicon micromachining. Silicon is one of the fundamental materials of the semiconductor industry and was used nearly exclusively in the early applications of microsystems technology (MST). Even now, silicon is the preferred material for the initial testing and integration of devices because its patterning techniques are very well known. Silicon offers a high degree of monolithic integration capacity and has very good mechanical properties. It remains a very attractive material because of the high quality of wafer finishing achievable. This also makes it an interesting material for mechanical sensor applications, since they often rely on precise bonding at the wafer level" @default.
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- W3023974655 date "2011-01-01" @default.
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- W3023974655 title "Basic Technologies for Microsystems" @default.
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- W3023974655 doi "https://doi.org/10.1016/b978-0-8155-1582-1.00002-2" @default.
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